Zobrazeno 1 - 1
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pro vyhledávání: '"Bihuan Yang"'
Autor:
Chu Chen, Zhongyin Zhang, Boan Zhong, Chen Naiqi, Bihuan Yang, Yue Liu, Dawei Tang, Jie Zhu, Tongxiang Fan, Jian Song, Haohao Zhao, Yang Kunming
Publikováno v:
Acta Materialia. 220:117283
Owing to high thermal conductivity (k) and appropriate coefficient of thermal expansion (CTE), Diamond/copper (Dia/Cu) composites have attracted extensive attention as advanced thermal management materials, but also suffered with low thermal boundary