Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Bih Wen Fon"'
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The search for an acceptable die attach solution to the European End of Life Vehicle RoHS Directive has proven problematic for the industry with several potential materials being evaluated. The mandate affects a full array of semiconductor device typ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4928be3247dd8234aa6f5c508176002
https://doi.org/10.1109/ectc.2013.6575790
https://doi.org/10.1109/ectc.2013.6575790
Autor:
Bih Wen Fon, Atapol Prajuckamol
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
In addressing emerging high speed interface such as USB 2.0, IEEE1394, LVDS and DVI in electronic devices, discrete solution of using choke and ESD diodes is a common practice in the PCB assembly in eliminating the common mode noise and providing ESD
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11a2dae544a6c41435a87a602ab2e450
https://doi.org/10.1109/iemt.2010.5746697
https://doi.org/10.1109/iemt.2010.5746697
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
In the fast-paced semiconductor industry, the need for innovative package solutions arises in order to cope with emerging miniaturization trend. Micro leadless land grid array (μLLGA) surpasses other plastic encapsulated packages with remarkable pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4304f78a26de0e20b948603f98f3ba6b
https://doi.org/10.1109/iemt.2008.5507844
https://doi.org/10.1109/iemt.2008.5507844
Publikováno v:
2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2008, p1-6, 6p