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pro vyhledávání: '"Bigtree Li"'
Publikováno v:
ECS Transactions. 44:471-476
ILB (Integration liner barrier) is the combination of IMP (Ionic Metal Plasma) Ti and MOCVD (Metal-Organic-Chemical-Vapor-Deposition) TiN, which is widely employed in semiconductor manufacturing as a tungsten glue/barrier layer. Contact resistance is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6df608fe5818cc07e996f1a8fe16e829
https://doi.org/10.1149/1.3694355
https://doi.org/10.1149/1.3694355
