Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Bianca Boettge"'
Autor:
Stefan Behrendt, Klaus G. Nickel, Markus G. Scheibel, Stefan Kaessner, Bianca Boettge, Christoph Berthold
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 15:132-139
Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f0e991b48596905747e49c09ea9f817
https://doi.org/10.4071/imaps.661015
https://doi.org/10.4071/imaps.661015
Autor:
Sandy Klengel, Stefan Kaessner, A. Z. Miric, M. G. Scheibel, G. Hejtmann, R. Eisele, Falk Naumann, Matthias Petzold, S. Behrendt, Klaus G. Nickel, Bianca Boettge
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The paper introduces novel phosphate cement- and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules. These materials are aimi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b05c19baaa25f10ef30efe50f8939f8e
https://doi.org/10.1109/ectc.2018.00194
https://doi.org/10.1109/ectc.2018.00194
Autor:
Franz Schrank, Bianca Boettge, Joerg Siegert, Cathal Cassidy, Falk Naumann, Ronny Gerbach, Matthias Petzold
Publikováno v:
ECS Transactions. 50:253-262
Low-temperature plasma activated wafer bonding is an important technology for the 3D integration of semiconductor devices, such as sensors and CMOS devices integrated on opposite sides on the same chip. In a volume production environment, monitoring
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e2dea9b95e903a1745ce6f8ffeed76d
https://doi.org/10.1149/05007.0253ecst
https://doi.org/10.1149/05007.0253ecst
Autor:
Ronny Gerbach, Matthias Petzold, Fabian Schippel, Georg Lorenz, Bianca Boettge, Joerg Bagdahn, Falk Naumann, Lutz Berthold
Publikováno v:
ECS Transactions. 50:215-225
This study presents results of microstructure diagnostics and mechanical strength investigations for reactive bonded components. For this purpose silicon (Si) test specimen were bonded by using commercially available 40 µm thick nickel/aluminum (Ni/
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caf9b7d9a273c032efe0471039217ff5
https://doi.org/10.1149/05007.0215ecst
https://doi.org/10.1149/05007.0215ecst
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Failure analysis and material characterization for power electronics packaging is critical, yet extremely challenging due to the large variety of technologies and materials employed. The current paper presents two case studies describing how defects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85df75096b1825b35e2f78434d7d48df
https://doi.org/10.1109/ectc.2016.211
https://doi.org/10.1109/ectc.2016.211
Publikováno v:
ECS Meeting Abstracts. :2974-2974
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02ffba0ff39c15fff20c4b0563cbd4ea
https://doi.org/10.1149/ma2012-02/40/2974
https://doi.org/10.1149/ma2012-02/40/2974
Publikováno v:
Journal of Micromechanics and Microengineering. 20:064018
Reactive bonding is a still new low-temperature joining process that is based on reactive nanoscale multilayer systems. The heat required for the bonding process is generated by a self-propagating exothermic reaction within the multilayer system whil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f067e351a1f0fd5b60c3d454c583e564
https://doi.org/10.1088/0960-1317/20/6/064018
https://doi.org/10.1088/0960-1317/20/6/064018