Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Bian, Xinhai"'
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
Band-pass-filters (BPF) are critical components in the RF modules. Conventional discrete component solutions, like those from discrete SMDs or LTCC (Low temperature co-fired ceramic) technology. Typically, these passive components consume 60%–70% o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbbd775368f38c1723defc9d4f354004
https://doi.org/10.1109/icept.2014.6922579
https://doi.org/10.1109/icept.2014.6922579
Publikováno v:
2013 14th International Conference on Electronic Packaging Technology.
Nowadays, inductors are prone to be integrated into chip surface for miniaturization considerations in some RF applications, but high Q factor cannot be achieved because of the lossy CMOS Si substrate. In this study, single layer spiral coils of one
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f4bb63d177330a6661621ae68a8b1bf
https://doi.org/10.1109/icept.2013.6756413
https://doi.org/10.1109/icept.2013.6756413
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
With the development of radio frequency wireless communication technology, there are strong demands of spiral inductor with high performance and low profile. The inductor is a basic component of IPD (Integrated Passive Devices [1]) including oscillat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49b5ac6448f623f9bf9ae65da3c0a589
https://doi.org/10.1109/icept-hdp.2012.6474561
https://doi.org/10.1109/icept-hdp.2012.6474561
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging; 1/ 1/2012, p29-31, 3p