Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Bi Keyun"'
Autor:
Sun, Niefeng, Mao, Luhong, Mao, Weidong, Wang, Hezou, Wu, Xiang, Bi, Keyun, Zhao, Zhengping, Guo, Weilian, Wu, Xiawan, Zhou, Xiaolong, Chen, Bingke, Zhao, Yanjun, Yang, Kewu, Sun, Tongnian
Publikováno v:
In Journal of Physics and Chemistry of Solids 2008 69(2):372-375
Autor:
Sun, Niefeng *, Wu, Xiawan, Wu, Xiang, Zhao, Youwen, Cao, Lixin, Zhao, Quan, Guo, Weilian, Zhang, Ji, Bi, Keyun, Sun, Tongnian
Publikováno v:
In Journal of Crystal Growth May 2001 225(2-4):244-248
Autor:
Fung, S, Zhao, Youwen, Sun, Niefeng *, Beling, C.D, Chen, Xudong, Bi, Keyun, Wu, Xiang, Zhang, Ji, Sun, Tongnian
Publikováno v:
In Journal of Crystal Growth 2000 211(1):174-178
Autor:
Zhao, Y. W., Luo, Y. L., Fung, S., Beling, C. D., Sun, N. F., Chen, X. D., Cao, L. X., Sun, T. N., Bi, Keyun, Wu, Xiang
Publikováno v:
Journal of Applied Physics; 1/1/2001, Vol. 89 Issue 1, p86, 5p, 1 Chart, 4 Graphs
Autor:
Zhang, B., Carisey, Y.C.P., Damian, A., Poelma, René H., Zhang, Kouchi, van Zeijl, H.W., Bi, Keyun, Liu, Sheng, Zhou, Shengjun
Publikováno v:
Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT)
We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::06010dad130806d82a1d013acb368d82
http://resolver.tudelft.nl/uuid:73a9f7f7-a22d-4ef4-8ccd-7003d5bc1772
http://resolver.tudelft.nl/uuid:73a9f7f7-a22d-4ef4-8ccd-7003d5bc1772
Autor:
Bi Keyun
Publikováno v:
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85f8f9ecd5d90edd01f18840e32c5195
https://doi.org/10.1109/eptc.2003.1298682
https://doi.org/10.1109/eptc.2003.1298682