Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Bharath Ramakrishnan"'
Autor:
Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S Bakir
Publikováno v:
IEEE Access, Vol 10, Pp 59259-59269 (2022)
The stagnation of Dennard scaling along with the move towards heterogeneous 2.5D and 3D ICs is increasing the thermal design power (TDP) envelopes of general-purpose CPUs. With conventional cooling approaches such as air-cooling and cold plates, it i
Externí odkaz:
https://doaj.org/article/de8f10f5c0de4700aa5359b347744449
Autor:
Pulkit A. Misra, Ioannis Manousakis, Esha Choukse, Majid Jalili, Inigo Goiri, Ashish Raniwala, Brijesh Warrier, Husam Alissa, Bharath Ramakrishnan, Phillip Tuma, Christian Belady, Marcus Fontoura, Ricardo Bianchini
Publikováno v:
IEEE Micro. 42:10-17
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0250a7dc53469ca836fb1bb85c2f9eaf
https://doi.org/10.1109/mm.2022.3163107
https://doi.org/10.1109/mm.2022.3163107
Autor:
Mark Shaw, Robert Lankston, Ioannis Manousakis, Majid Jalili, Husam A. Alissa, Marcus Fontoura, Ricardo Bianchini, Ashish Raniwala, Pulkit A. Misra, Brijesh Warrier, Íñigo Goiri, Rich Baca, Monroe Mark Alan, Bharath Ramakrishnan, Christian L. Belady, Washington Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1703-1715
Computing capacity has always been on the upward climb due to the constant technological improvements in semiconductor manufacturing and packaging industry. This growth in computing capability is usually accompanied by a steep rise in heat flux densi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5c1bf1956845a04926ac886355a3ce8
https://doi.org/10.1109/tcpmt.2021.3106026
https://doi.org/10.1109/tcpmt.2021.3106026
Autor:
Husam A. Alissa, Bharath Ramakrishnan, Seth Morris, Eric C. Peterson, Ioannis Manousakis, Noah Mckay, Vaidehi Oruganti, Nicholas Andrew Keehn
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
A 10 kW scale model of a decoupled immersion cooling rig is constructed in order to serve as a testbed for immersion cooling, using 3M FC3284 dielectric cooling fluid. A species separator is constructed and demonstrates an ability to remove air from
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a5fa01f28a3f9440ca74e64faacb920
https://doi.org/10.1115/ipack2021-72682
https://doi.org/10.1115/ipack2021-72682
Autor:
Arvind Pattamatta, Paul R. Chiarot, Reza Pejman, Bharath Ramakrishnan, Srikanth Rangarajan, Bahgat Sammakia, Yaser Hadad
Publikováno v:
Applied Thermal Engineering. 150:720-737
A water-cooled multi-die heat sink with parallel rectangular micro-channels was designed to satisfy the operational requirements of a multi-die processor. A shape optimization strategy based on the RSM (response surface method) was used to minimize p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07f8d0f7e252998258ec09f3e841485c
https://doi.org/10.1016/j.applthermaleng.2018.12.128
https://doi.org/10.1016/j.applthermaleng.2018.12.128
Autor:
Ricardo Bianchini, Bharath Ramakrishnan, Phillip Tuma, Marcus Fontoura, Christian L. Belady, Ashish Raniwala, Ioannis Manousakis, Íñigo Goiri, Husam A. Alissa, Pulkit A. Misra, Majid Jalili
Publikováno v:
ISCA
Cloud providers typically use air-based solutions for cooling servers in datacenters. However, increasing transistor counts and the end of Dennard scaling will result in chips with thermal design power that exceeds the capabilities of air cooling in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f38eb55526a2c5c810fee22302991834
https://doi.org/10.1109/isca52012.2021.00055
https://doi.org/10.1109/isca52012.2021.00055
Autor:
Sadegh Khalili, Yaser Hadad, Bahgat Sammakia, Cong Hiep Hoang, Arvind Pattamatta, Bharath Ramakrishnan, Srikanth Rangarajan
Publikováno v:
Journal of Electronic Packaging. 143
High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling heat transfer technique is wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06448cc1f978a3baab75b34088779996
https://doi.org/10.1115/1.4049928
https://doi.org/10.1115/1.4049928
Publikováno v:
Journal of Electronic Packaging. 141
Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of microelectronic devices and an incre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::575ffb9231c02b879966e0df12f81c54
https://doi.org/10.1115/1.4044130
https://doi.org/10.1115/1.4044130
Publikováno v:
INDIN
Miniaturization of microelectronic components comes at a price of high heat flux density. By adopting liquid cooling, the rising demand of high heat flux devices can be met while the reliability of the microelectronic devices can also be improved to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::222722a8dbad82528594cb6b382dfa86
https://doi.org/10.1109/indin41052.2019.8972030
https://doi.org/10.1109/indin41052.2019.8972030
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
This work experimentally studies the impact of facility cooling failure of a direct liquid cooling (DLC) system on the IT equipment (ITE). The facility side of a DLC system removes the heat from a secondary loop — in direct contact with the ITE —
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49dd10baa6e84625ffa72cc0ee5a5b56
https://doi.org/10.1115/ipack2018-8443
https://doi.org/10.1115/ipack2018-8443