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Autor:
Mark Devlin, Michael B. Glasgow, Chip Hewette, William T. Kearney, Khaled A. Zreik, Michael B. Viola, Bhapinder Puri, Chad Brizendine, Brian R. Goodman
Publikováno v:
SAE Technical Paper Series.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0166ee06824f94c08c71bf0ee29c2cdb
https://doi.org/10.4271/2022-01-5008
https://doi.org/10.4271/2022-01-5008
