Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Berthold Moeller"'
Autor:
Berthold Möller
Liebe Leserinnen und Leser, Es ist uns eine große Freude, Sie in die zauberhafte Welt von'Lukas'Abenteuer im Zauberwald'einzuladen. Diese Geschichten erzählen von einem jungen Mann namens Lukas, der einst als Kind den Zauberwald betrat und von sein
Autor:
Alain Phommahaxay, Berthold Moeller, Andy Miller, Jakob Visker, Erik Sleeckx, Kaori Yokoyama, Fumihiro Inoue, Eric Beyne, Lan Peng, Kenneth June Rebibis, Anne Jourdain
Publikováno v:
Microelectronic Engineering. 167:10-16
The impact of the edge trimming process on permanently bonded wafers is described. The edge trimming process is a blade sawing process applied on the Si wafer edge and bevel, removing the fragile edge of the wafer prior to grinding. We investigated t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b7a83108149dd3291198d35e48de612
https://doi.org/10.1016/j.mee.2016.10.014
https://doi.org/10.1016/j.mee.2016.10.014
Autor:
Samuel Suhard, Fumihiro Inoue, Hitoshi Hoshino, Alain Phommahaxay, Eric Beyne, Andy Miller, Kenneth June Rebibis, Berthold Moeller, Arnita Podpod, Erik Sleeckx
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Feasibility study of alternative dicing technologies for collective die to wafer direct bonding combined with wafer to wafer direct bonded dies has been performed. Several dicing technologies such as blade dicing, laser grooving + plasma dicing, lase
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4535dcfd008e13b6f54973eb07084f59
https://doi.org/10.1109/ectc.2019.00073
https://doi.org/10.1109/ectc.2019.00073
Autor:
Fumihiro Inoue, Jaber Derakhshandeh, Berthold Moeller, Yohei Gokita, Fabrice Duval, Pieter Bex, Giovanni Capuz, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Gerald Beyer, Eric Beyne
Publikováno v:
ECS Meeting Abstracts. :1135-1135
Advanced packaging, including fan-outs, 2.5D and 3D integration is gaining more interests as alternative driving force for performance improvement instead of scaling. A key element for the advanced packaging is interconnection technology between diff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b03c94f73732d7948f37dcc4fe66639
https://doi.org/10.1149/ma2018-02/33/1135
https://doi.org/10.1149/ma2018-02/33/1135