Zobrazeno 1 - 10
of 75
pro vyhledávání: '"Bertaud, T."'
Resistive switching of HfO2-based Metal–Insulator–Metal diodes: Impact of the top electrode material
Autor:
Bertaud, T., Walczyk, D., Walczyk, Ch., Kubotsch, S., Sowinska, M., Schroeder, T., Wenger, Ch., Vallée, C., Gonon, P., Mannequin, C., Jousseaume, V., Grampeix, H.
Publikováno v:
In Thin Solid Films 1 May 2012 520(14):4551-4555
Autor:
Walczyk, D., Walczyk, Ch., Schroeder, T., Bertaud, T., Sowińska, M., Lukosius, M., Fraschke, M., Tillack, B., Wenger, Ch.
Publikováno v:
In Microelectronic Engineering 2011 88(7):1133-1135
Autor:
Bertaud, T., Defay, E., Bermond, C., Lacrevaz, T., Abergel, J., Salem, B., Capraro, S., Flechet, B.
Publikováno v:
In Microelectronic Engineering 2011 88(5):564-568
Autor:
Bertaud, T., Bermond, C., Lacrevaz, T., Vallée, C., Morand, Y., Fléchet, B., Farcy, A., Gros-Jean, M., Blonkowski, S.
Publikováno v:
In Microelectronic Engineering 2010 87(3):301-305
Autor:
Bertaud, T., Bermond, C., Blonkowski, S., Vallée, Corentin, Lacrevaz, T., Farcy B. Fléchet, A.
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2012, 2 (3), pp.502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2 (3), pp.502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2012, 2 (3), pp.502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2 (3), pp.502-509
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::11122e3498a86fff195931a6134eab23
https://hal.archives-ouvertes.fr/hal-01025008
https://hal.archives-ouvertes.fr/hal-01025008
Autor:
Bertaud, T., Bermond, C., Blonkowski, S., Vallée, Corentin, Lacrevaz, T., Farcy, A., Gros-Jean, M., Fléchet, B.
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2012, pp.2 (2012) 502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, pp.2 (2012) 502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2012, pp.2 (2012) 502-509
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, pp.2 (2012) 502-509
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::75d55a2594cceb77448946ce1b5fac86
https://hal.archives-ouvertes.fr/hal-00777838
https://hal.archives-ouvertes.fr/hal-00777838
Autor:
Bertaud, T., Bermond, C., Blonkowski, S., Goullet, Antoine, Vallée, Corentin, Farcy, A., Lacrevaz, T., Fléchet, B.
Publikováno v:
17èmes journées nationales micro-ondes
JNM'11
JNM'11, May 2011, Brest, France
XVIIes Journées Nationales Microondes
XVIIes Journées Nationales Microondes, 2011, Brest, France
XVIIe Journées Nationales Microondes
XVIIe Journées Nationales Microondes, 2011, Brest, France
JNM'11
JNM'11, May 2011, Brest, France
XVIIes Journées Nationales Microondes
XVIIes Journées Nationales Microondes, 2011, Brest, France
XVIIe Journées Nationales Microondes
XVIIe Journées Nationales Microondes, 2011, Brest, France
National audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::e1d20c9ed2d008afd3898b11a2ad2881
https://hal.archives-ouvertes.fr/hal-01073531
https://hal.archives-ouvertes.fr/hal-01073531
Autor:
Gorisse, M., Bertaud, T., Reinhardt, A., Borel, M., Billard, C., Defaÿ, E., Lacrevaz, T., Bermond, C.
Publikováno v:
IEEE International Frequency Control Symposium and European Frequency and Time Forum (IFCS 2011)
IEEE International Frequency Control Symposium and European Frequency and Time Forum (IFCS 2011), May 2011, San Francisco, United States
IEEE International Frequency Control Symposium and European Frequency and Time Forum (IFCS 2011), May 2011, San Francisco, United States
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::261c6a11e73ba676dcd4f27d20319b84
https://hal.archives-ouvertes.fr/hal-01068868
https://hal.archives-ouvertes.fr/hal-01068868
Publikováno v:
Journal of Applied Physics
Journal of Applied Physics, American Institute of Physics, 2011, pp.1107 044110
Journal of Applied Physics, 2011, pp.1107 044110
Journal of Applied Physics, American Institute of Physics, 2011, pp.1107 044110
Journal of Applied Physics, 2011, pp.1107 044110
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::850931dc00221e62e0fb204f0e872fdd
https://hal.archives-ouvertes.fr/hal-00669410
https://hal.archives-ouvertes.fr/hal-00669410
Publikováno v:
Journal of Applied Physics
Journal of Applied Physics, American Institute of Physics, 2011, Vol. 110 (4), pp.044110
Journal of Applied Physics, American Institute of Physics, 2011, Vol. 110 (4), pp.044110
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::f440a475d63036a1c1af39494ae9a3b6
https://hal.archives-ouvertes.fr/hal-01068744
https://hal.archives-ouvertes.fr/hal-01068744