Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Bersu Baştuğ Azer"'
Autor:
Yverick Rangom, Oleksii Sherepenko, Ahad Shafiee, Alek Cholewinski, Kiran Gundegowda Kalligowdanadoddi, Bersu Bastug Azer, Parisa Jafarzadeh, Boxin Zhao, Elliot Biro, Holger Kleinke, Michael A. Pope
Publikováno v:
Advanced Science, Vol 11, Iss 46, Pp n/a-n/a (2024)
Abstract Carbonaceous and carbon‐coated electrodes are ubiquitous in electrochemical energy storage and conversion technologies due to their electrochemical stability, lightweight nature, and relatively low cost. However, traditional reliance on co
Externí odkaz:
https://doaj.org/article/db1eb56db58b4d91a57c6968e9da60d6
Autor:
Tamara Ecem Korkut, Ezgi Rana Temel, Ezel Boyacı, Kubra Kahremanoglu, Caner Durucan, Mürvet Volkan, Atakan Arda Nalbant, Bersu Baştuğ Azer
Publikováno v:
Journal of separation scienceREFERENCES. 43(9-10)
Recently the connection between oxidative stress and various diseases, including cancer and Alzheimer's, attracts notice as a pathway suitable for diagnostic purposes. 8-Oxo-deoxyguanosine and 8-oxo-deoxyadenosine produced from the interaction of rea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::319467604b3f6356cd94f9de5b21e33f
https://pubmed.ncbi.nlm.nih.gov/32118350
https://pubmed.ncbi.nlm.nih.gov/32118350
Autor:
Dogu Ozyigit, Farman Ullah, Ahmet Gulsaran, Bersu Bastug Azer, Ahmed Shahin, Kevin Musselman, Michal Bajcsy, Mustafa Yavuz
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-9 (2023)
Abstract Quantum-tunneling metal–insulator-metal (MIM) diodes have emerged as a significant area of study in the field of materials science and electronics. Our previous work demonstrated the successful fabrication of these diodes using atmospheric
Externí odkaz:
https://doaj.org/article/5a69d6b6ff784d7ab0c860506ee00b93
Autor:
Ahmet Gulsaran, Bersu Bastug Azer, Dogu Ozyigit, Resul Saritas, Samed Kocer, Eihab Abdel-Rahman, Mustafa Yavuz
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1473 (2023)
Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues. In this study, we propose a built-in packaging method and
Externí odkaz:
https://doaj.org/article/997e8a7bd1a441d9bde91f9799c5cc49
Autor:
Ahmet Gulsaran, Bersu Bastug Azer, Samed Kocer, Sasan Rahmanian, Resul Saritas, Eihab M. Abdel-Rahman, Mustafa Yavuz
Publikováno v:
Sensors, Vol 22, Iss 14, p 5264 (2022)
An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interco
Externí odkaz:
https://doaj.org/article/9a22d99e6b3143b0ac86965112721d15