Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Bernhard Czerny"'
Autor:
Bernhard Czerny, Sebastian Schuh
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2002 (2023)
Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigue is one of the main reliability issues in power LED devices. Currently, the standard testing methods to evaluate the device’s lifetime involve time
Externí odkaz:
https://doaj.org/article/3e3503f9519142a493f5f3caa4d7cea4
Autor:
Sebastian Schuh, Bernhard Czerny
Publikováno v:
Integrated Optics: Design, Devices, Systems and Applications VII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::244a4e32ebcbb1c431e1417b0f5041c9
https://doi.org/10.1117/12.2665481
https://doi.org/10.1117/12.2665481
Autor:
Bernhard Czerny, Sebastian Schuh
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74638e9d844c712c82b1e5e0e80fd885
https://doi.org/10.1109/eurosime56861.2023.10100839
https://doi.org/10.1109/eurosime56861.2023.10100839
Autor:
Bernhard Czerny, Golta Khatibi
Publikováno v:
International Symposium on Microelectronics. 2021:000390-000396
This paper presents case studies on application of accelerated mechanical fatigue testing for evaluation of wire bond interconnects and interfaces in electronic devices. A dedicated experimental set-up is designed to induce fatigue failure in the wea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a82924f70e7c72c996c60d5963d8ce5
https://doi.org/10.4071/1085-8024-2021.1.000390
https://doi.org/10.4071/1085-8024-2021.1.000390
Autor:
Enrique Castillo, Alfonso Fernández-Canteli, Sergio Blasón, Golta Khatibi, Bernhard Czerny, Mohammad Zareghomsheh
Publikováno v:
Open Journal of Statistics. 11:1072-1096
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c10c6391dc3e35a68d18756289a71b0
https://doi.org/10.4236/ojs.2021.116064
https://doi.org/10.4236/ojs.2021.116064
Autor:
Bernhard Czerny, Golta Khatibi, Kristian Bonderup Pedersen, Steffen Buhrkal-Donau, Haoze Luo, Francesco Iannuzzo, Vladimir Popok
Publikováno v:
Popok, V, Buhrkal-Donau, S, Czerny, B, Khatibi, G, Luo, H, Iannuzzo, F & Pedersen, K 2019, ' Comparative study of wire bond degradation under power and mechanical accelerated tests ', Journal of Materials Science: Materials in Electronics, vol. 30, no. 18, pp. 17040-17045 . https://doi.org/10.1007/s10854-019-02050-0
Degradation of wire bonds under accelerated power cycling tests is compared to that caused by mechanical high-frequency cycling for commercial power devices. Using micro-sectioning approach and optical microscopy it is found that the bond fracture un
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::53eb9fd2b4f711d4df7af09926929509
https://doi.org/10.1007/s10854-019-02050-0
https://doi.org/10.1007/s10854-019-02050-0
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Two in-situ failure detection methods by measuring acoustic emissions and transducer responses are presented to investigate the wire bond degradation failure during a highly accelerated mechanical fatigue test. This BAMFIT fatigue test is used to ind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::27e9e00d213c0d73eb69494f2a9f32d5
https://doi.org/10.1109/estc48849.2020.9229726
https://doi.org/10.1109/estc48849.2020.9229726
Autor:
Bernhard Czerny, Golta Khatibi
Publikováno v:
tm - Technisches Messen. 85:213-220
Every new development in device performance and packaging design, can drastically affect the reliability of devices due to implementation of new materials and design changes. High performance and high reliability demands in power electronics over sev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9def9155dbda63d5aba3b22095ec3e1d
https://doi.org/10.1515/teme-2017-0131
https://doi.org/10.1515/teme-2017-0131
Autor:
Kjeld Møller Pedersen, Dennis Achton Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Kristian Bonderup Pedersen, Vladimir Popok
Publikováno v:
Microelectronics Reliability. :373-377
This paper presents a fundamental study on degradation of heavy Al bond wires typically used in high power modules. Customized samples are designed to only consist of Al bond wires on standard Si diodes. These samples are subjected to pure mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ebc96de1da5258a972b8faa0bed7f2ef
https://doi.org/10.1016/j.microrel.2017.07.055
https://doi.org/10.1016/j.microrel.2017.07.055
Autor:
Golta Khatibi, Johann Nicolics, L. Weiss, Bernhard Czerny, Martin Lederer, Ali Mazloum-Nejadari
Publikováno v:
Microelectronics Reliability. 74:147-154
In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad (Low Profile Quad Flat-Exposed Pad) package was investigated by numerical and experimental means. The aim was to develop a methodology for fast evaluation of the pac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69d035b95e39ddaf005f2db98fba6281
https://doi.org/10.1016/j.microrel.2017.04.014
https://doi.org/10.1016/j.microrel.2017.04.014