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pro vyhledávání: '"Bernd K Appelt"'
Autor:
Bernd K. Appelt
Publikováno v:
Materials for Advanced Packaging ISBN: 9783319450971
Materials for Advanced Packaging ISBN: 9780387782188
Materials for Advanced Packaging ISBN: 9780387782188
This chapter reviews materials and processing for fabricating organic substrates including laminate substrates for plastic BGA (PBGA), build-up substrates for flip chip BGA (FCBGA), tape substrate for tape BGA (TBGA), coreless substrate, and some spe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ef413e92c49b81aa747fe4070bd68ad3
https://doi.org/10.1007/978-3-319-45098-8_7
https://doi.org/10.1007/978-3-319-45098-8_7
Publikováno v:
International Symposium on Microelectronics. 2012:001149-001154
The continued drive for miniaturization by mobile applications demands its toll also from packaging. Innovative packages are required to shrink volume and weight of packages. This has led to the development of single layer, coreless and embedded comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a6380d216e6f217e1c476d9d11fcd9c
https://doi.org/10.4071/isom-2012-thp45
https://doi.org/10.4071/isom-2012-thp45
Autor:
Bernd K. Appelt
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:001477-001506
What does thin or ultra-slim packaging mean? That of course depends on the particular cross-section of the substrate e.g. single layer vs. double layer vs. coreless or embedded component substrate, etc. The thinnest prepreg based substrate and concom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4ef15678428e41e52639a9ea520139d
https://doi.org/10.4071/2012dpc-wa21
https://doi.org/10.4071/2012dpc-wa21
Publikováno v:
International Symposium on Microelectronics. 2012:001143-001148
Historically, power die like MOSFETs have been packaged on lead frames using wire bonds as interconnects. To facilitate current carrying requirements, thick wires and sometimes also clips were used, to handle the total electrical and thermal conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::283252a2c99e34cee2e12983bb0b8ff6
https://doi.org/10.4071/isom-2012-thp44
https://doi.org/10.4071/isom-2012-thp44
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002377-002403
fcCSP packaging was historically based on solder interconnects. The continued drive towards higher I/O and shrinking package sizes has lead to very dense bump pitches which exceed those of CPUs. At area array bump pitches below 150 um, solder bumps r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::783487d3e1c84c766aba59aece4c01e7
https://doi.org/10.4071/2011dpc-tha32
https://doi.org/10.4071/2011dpc-tha32
Publikováno v:
Microelectronics Reliability. 51:13-20
Wire bonding is the predominant mode of interconnection in electronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years of reliability data. Economic re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b80481f1fb4bbf5baef4fd944aaf94d
https://doi.org/10.1016/j.microrel.2010.06.006
https://doi.org/10.1016/j.microrel.2010.06.006
Autor:
Bernd K Appelt
Publikováno v:
International Symposium on Microelectronics. 2011:001074-001078
3D packaging is coming of age. Initially it was conceived to provide more memory in the same space. Memory die were stacked after thinning the die and bonding them on top of each other using conventional, thin die bond adhesive. The interconnect meth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::919d8afecc12c7b450450041ec4e8375
https://doi.org/10.4071/isom-2011-tha6-paper2
https://doi.org/10.4071/isom-2011-tha6-paper2
Publikováno v:
International Symposium on Microelectronics. 2010:000650-000655
Fine pitch gold wire bonding is the pre-eminent technology for die interconnection and has been advanced to very fine wire diameters. Copper wire bonding has been used for many years as well but was relegated to large wire diameters in automotive and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43e439e942bded728470e25f6525d589
https://doi.org/10.4071/isom-2010-wp4-paper1
https://doi.org/10.4071/isom-2010-wp4-paper1
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
The booming business of mobile applications like cell phones, tablet computers, etc., is intimately linked to their thin packaging format and is continuing the drive for ever thinner applications. Concomitantly, the electronic packages inside the app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24ab6d1b59eb5b370da4eed6e148fc82
https://doi.org/10.1109/emap.2012.6507839
https://doi.org/10.1109/emap.2012.6507839
Publikováno v:
Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B.
Historically, power die like MOSFETs have been packaged on lead frames using wire bonds as interconnects. To facilitate current carrying requirements, thick wires and sometimes also clips were used, to handle the total electrical and thermal conducti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef409d3156fc0a84a4de1953d21a086c
https://doi.org/10.1115/imece2012-88925
https://doi.org/10.1115/imece2012-88925