Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Bernard Plano"'
Autor:
Corinne Dejous, Hamida Hallil, Vincent Raimbault, Jean-Luc Lachaud, Bernard Plano, Raphaël Delépée, Patrick Favetta, Luigi Agrofoglio, Dominique Rebière
Publikováno v:
Sensors, Vol 16, Iss 6, p 915 (2016)
Cancer is a leading cause of death worldwide and actual analytical techniques are restrictive in detecting it. Thus, there is still a challenge, as well as a need, for the development of quantitative non-invasive tools for the diagnosis of cancers an
Externí odkaz:
https://doaj.org/article/d5c78b6f9661420aaad8d69d81babd2b
Autor:
Hélène Debéda, Alexandrine Gracia, Magali Dematos, Isabelle FAVRE, Bernard Plano, Jean Tomas, Reasmey Tan, Rouabhi, C., Marc Respaud
Publikováno v:
JPCNFM 2021,16ième journées pédagogiques du CNFM Saint Malo
JPCNFM 2021,16ième journées pédagogiques du CNFM Saint Malo, Dec 2021, Saint-Malo, France
HAL
JPCNFM 2021,16ième journées pédagogiques du CNFM Saint Malo, Dec 2021, Saint-Malo, France
HAL
Les deux pôles CNFM (Coordination Nationale pour la Formation en Microélectronique et en nanotechnologies) de Toulouse et Bordeaux, AIME et PCB respectivement, ont associé leurs compétences pour créer des formations sur la thématique de l’él
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dbab7957ef99727c94f6a4e0b8c5ec9c
https://hal.science/hal-03500175
https://hal.science/hal-03500175
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2020, 114, pp.113936-. ⟨10.1016/j.microrel.2020.113936⟩
Microelectronics Reliability, Elsevier, 2020, 114, pp.113936-. ⟨10.1016/j.microrel.2020.113936⟩
This paper presents an investigation aiming to determine the thresholds that lead to the destruction of power supplies components, such as rectifier bridge and rectifier diode, under differential mode electric pulse injection in the case of High Elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cfa69b536061a246939be93c9fa863f9
https://hal.archives-ouvertes.fr/hal-03493510
https://hal.archives-ouvertes.fr/hal-03493510
Autor:
Chandan Yadav, Thomas Zimmer, Sebastien Fregonese, Bernard Plano, Marina Deng, Magali De Matos, Marco Cabbia
Publikováno v:
IEEE Transactions on Terahertz Science and Technology
IEEE Transactions on Terahertz Science and Technology, Institute of Electrical and Electronics Engineers, In press, pp.1-1. ⟨10.1109/TTHZ.2020.3004517⟩
IEEE Transactions on Terahertz Science and Technology, Institute of Electrical and Electronics Engineers, In press, pp.1-1. ⟨10.1109/TTHZ.2020.3004517⟩
International audience; In this paper, we present on-silicon structures on-wafer measurements up to 500 GHz and a comprehensive electromagnetic (EM) simulation analysis to understand non-ideal behaviour in the measured data. The EM simulations are pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6ceee939212ee21ac849b7aabb38763f
https://hal.archives-ouvertes.fr/hal-02884144
https://hal.archives-ouvertes.fr/hal-02884144
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2021, pp.114286. ⟨10.1016/j.microrel.2021.114286⟩
Microelectronics Reliability, Elsevier, 2021, pp.114286. ⟨10.1016/j.microrel.2021.114286⟩
This paper presents the impact of temperature on the corrosion behaviour of lead-free solder alloy during neutral salt spray (NSS) test. The focus is made on the Sn-Ag-Cu (SAC305) solder alloy Ball Grid Array components. Components were aged during 2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a06f227cb2a5eb7ed664e562442be43
https://doi.org/10.1016/j.microrel.2021.114286
https://doi.org/10.1016/j.microrel.2021.114286
Autor:
Porkodi Kadhirvel, Mohamed G. Ayari, Luigi A. Agrofoglio, Benjamin Carbonnier, Bernard Plano, Patrick Favetta, Corinne Dejous
Publikováno v:
Materials Science and Engineering: C
Materials Science and Engineering: C, Elsevier, 2019, 101, pp.254-263. ⟨10.1016/j.msec.2019.03.102⟩
Materials Science and Engineering: C, 2019, 101, pp.254-263. ⟨10.1016/j.msec.2019.03.102⟩
Materials Science and Engineering: C, Elsevier, 2019, 101, pp.254-263. ⟨10.1016/j.msec.2019.03.102⟩
Materials Science and Engineering: C, 2019, 101, pp.254-263. ⟨10.1016/j.msec.2019.03.102⟩
International audience; Herein, we propose the synthesis of a microspherical imprinted hydrogel meant for the controlled release of a nucleotide, adenosine 5'-monophosphate (5'-AMP). Indeed, molecularly imprinted polymers-based (MIPs) materials posse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::847c7147de6a2184217879e81fe2abb0
https://hal.archives-ouvertes.fr/hal-02299722/document
https://hal.archives-ouvertes.fr/hal-02299722/document
Autor:
A. Courjaud, Takunori Taira, Bruno Levrier, Bernard Plano, M. A. Lemesre, Simon Joly, C. Lyszyk, Laurent Bechou
Publikováno v:
Optics & Laser Technology
Optics & Laser Technology, 2018, 105, pp.229-241. ⟨10.1016/j.optlastec.2018.02.054⟩
Optics & Laser Technology, 2018, 105, pp.229-241. ⟨10.1016/j.optlastec.2018.02.054⟩
While considerable effort in the field of high power laser research has been dedicated to evolving thin-disk Lasers into the kilowatt range, thermal and residual stress management remain a critical issue and need to be addressed. In this paper, a qua
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b985e0e5557b547580a0435ea8bdcd79
https://hal.archives-ouvertes.fr/hal-02273406
https://hal.archives-ouvertes.fr/hal-02273406
Publikováno v:
Microelectronics Reliability. 55:192-200
Two important trends in the microelectronics business are the development of three dimensional packaging solutions which increase the number electronics components on the same area, and the application of VLSI electronics under harsh environment cond
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a0706fa876cac3217c2466c2a5bcc31
https://doi.org/10.1016/j.microrel.2014.09.030
https://doi.org/10.1016/j.microrel.2014.09.030
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads
Publikováno v:
Microelectronics Reliability. 53:1575-1580
The progress in three dimensional packaging leads to smaller solder joints. A growing part of their volume consists of IMCs (intermetallic compounds). The IMCs are formed through migration processes during the soldering. These phenomena continue duri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3acdc249c922158e9406e31bf2791535
https://doi.org/10.1016/j.microrel.2013.07.038
https://doi.org/10.1016/j.microrel.2013.07.038
Autor:
Zahra Fattah, Dodzi Zigah, Jérome Roche, Bernard Plano, Bertrand Goudeau, Laurent Bouffier, Cédric Ayela, Alexander Kuhn, Gwendoline Tisserant
Publikováno v:
Electrochimica Acta
Electrochimica Acta, Elsevier, 2015, 179, pp.276-281. ⟨10.1016/j.electacta.2015.03.102⟩
Electrochimica Acta, Elsevier, 2015
Electrochimica Acta, Elsevier, 2015, 179, pp.276-281. ⟨10.1016/j.electacta.2015.03.102⟩
Electrochimica Acta, Elsevier, 2015
International audience; Bipolar electrochemistry is an unconventional technique that currently encounters a renewal of interest due to modern applications in the fields of analytical chemistry or materials science. The approach is particularly releva
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3dce3e0439fb737e1e3265f68d691ab2
https://hal.archives-ouvertes.fr/hal-02049662/file/Tisserant_21899.pdf
https://hal.archives-ouvertes.fr/hal-02049662/file/Tisserant_21899.pdf