Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Bernard Glasauer"'
Publikováno v:
2023 24th International Symposium on Quality Electronic Design (ISQED).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b21ff46603ade5d0fe5af6583f6a2503
https://doi.org/10.1109/isqed57927.2023.10129339
https://doi.org/10.1109/isqed57927.2023.10129339
Autor:
Vishnu Shukla, Nicholas Ayers, Andrea Moreno, Natalie Crutchfield, Devin Lyons, Omar Ahmed, Peng Su, Bernard Glasauer, Tengfei Jiang
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e684b37d3fd2af7ee4c042e9636d1d6f
https://doi.org/10.1109/ectc51906.2022.00266
https://doi.org/10.1109/ectc51906.2022.00266
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Mechanical integrity of low-k dielectric films remains a quality and reliability challenge for devices using advanced silicon nodes. In wafer fabs, while great efforts are made in controlling and monitoring individual processing steps, the overall me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b3c86ef069abae774fb1d43287dd504
https://doi.org/10.1109/ectc32696.2021.00139
https://doi.org/10.1109/ectc32696.2021.00139
Autor:
Bernard Glasauer, Ian Bernander, Travis F. Dale, Yuvraj Singh, Peng Su, Carol A. Handwerker, Ganesh Subbarayan
Publikováno v:
Journal of Electronic Packaging. 142
Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60972c33dddc6a81c8df76f1911c57ec
https://doi.org/10.1115/1.4048109
https://doi.org/10.1115/1.4048109
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Mechanical integrity of low-k dielectrics continues to be an important focus for advanced semiconductor devices. In wafer fabs, while great efforts are made to control individual processing steps, in some cases the overall mechanical quality of the f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0284996e18613e3f0e6389c21c8320b6
https://doi.org/10.1109/ectc32862.2020.00239
https://doi.org/10.1109/ectc32862.2020.00239
Autor:
Ian Bernander, Ganesh Subbarayan, Travis F. Dale, Peng Su, Carol A. Handwerker, Yuvraj Singh, Bernard Glasauer
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39c661b15d7d3dd163f036bff4aa73f1
https://doi.org/10.1115/ipack2019-6507
https://doi.org/10.1115/ipack2019-6507