Zobrazeno 1 - 10
of 98
pro vyhledávání: '"Bernard Flechet"'
Autor:
Younes Boujmad, Jean-Paul Barbosa, Marie Prudhom, Farsin Khalili, Olivier Gavard, Edith Husson-Charlet, Philippe Artillan, Bernard Flechet, Cedric Bermond
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1684-1692
This article focuses on the electrical performance of a new Ethernet contact with four differential pairs called “Octomax.” The eight pins of the contact are inserted in a section of 17 mm2. Such a high-speed interconnect solution is specially de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53bbac40f89ac0d160c97f81d360d1a1
https://doi.org/10.1109/tcpmt.2020.3022105
https://doi.org/10.1109/tcpmt.2020.3022105
Autor:
Yann Lamy, Anne-Laure Perrier, Khadim Dieng, Olivier Guiller, Bernard Flechet, Alexis Farcy, Philippe Artillan, Cedric Bermond, Thierry Lacrevaz, Grégory Houzet, Sylvain Joblot
Publikováno v:
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩
International audience; The feasibility of cointegration of new capacitors, named “through silicon capacitors” (TSCs) with “through silicon vias” in silicon interposers has recently been demonstrated. Two architectures of TSC are extensively
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::47bc48de94b0dad144236ff674e0a8cf
https://doi.org/10.1109/tcpmt.2017.2655939
https://doi.org/10.1109/tcpmt.2017.2655939
Publikováno v:
Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution ISBN: 9789811505515
To meet the industrial best performance with optimal ratio of cost quality, the semiconductor industry innovates constantly the PCB design and implementation techniques.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7de9601f711ed27c4b9f8f246f2545da
https://doi.org/10.1007/978-981-15-0552-2_8
https://doi.org/10.1007/978-981-15-0552-2_8
Autor:
Jean-Paul Barbosa, Edith Husson-Charlet, Cedric Bermond, Farsin Khalili, Olivier Gavard, Philippe Artillan, Bernard Flechet, Marie Prudhom, Younes Boujmad
Publikováno v:
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI)
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambéry, France. pp.1-4, ⟨10.1109/SaPIW.2019.8781655⟩
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambery, France
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambéry, France. pp.1-4, ⟨10.1109/SaPIW.2019.8781655⟩
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambery, France
Connectors play an essential role in the overall performance of analog and digital electronic systems. Designs, modelling and characterization results of new Ethernet contacts with four differential pairs, named "Ethernet #8"and offering very large b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6da9b6b5d3b0605c00b405639e59ef52
https://hal.archives-ouvertes.fr/hal-02279227
https://hal.archives-ouvertes.fr/hal-02279227
Publikováno v:
2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI).
For an embedded transmission line, as interconnect in integrated circuits or in high density PCB, the extraction of its characteristic impedance from S-parameters measurements remains a challenge. Robust de-embedding procedures are required to avoid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43870e14eeb339c189539a38a2bbd2f9
https://doi.org/10.1109/sapiw.2019.8781663
https://doi.org/10.1109/sapiw.2019.8781663
Autor:
Grégory Houzet, David Auchere, Cedric Bermond, Thierry Lacrevaz, Philippe Artillan, Laurent Schwarz, Bernard Flechet
Publikováno v:
Microelectronics Journal. 108:104990
Insulating materials used for the packaging of integrated circuits play an important role in the electrical performance of the new System-in-Package (SiP), designed to support flows greater than 10 Gbits/s. These insulating materials must have a low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01d4894ecff6829c6478c201c693bb8c
https://doi.org/10.1016/j.mejo.2021.104990
https://doi.org/10.1016/j.mejo.2021.104990
Autor:
Thierry Lacrevaz, Jean-Charles Barbe, Remi Velard, Alexis Farcy, Lucile Cheramy, Kevin Morot, Bernard Flechet, Roselyne Segaud, Helene Jacquinot, Lucile Arnaud
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.2000-2006, ⟨10.1109/ECTC.2018.00300⟩
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.2000-2006, ⟨10.1109/ECTC.2018.00300⟩
This work aims at providing a RLCG modeling and performance optimization of Redistribution Layer (RDL) in a non-HR substrate up to 67 GHz. Similarly to TSVs, RDL modeling can not be assessed by standard parasitic extraction CAD tools. Therefore, we p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2e4971ab4228f2193472a951f2cd5b07
https://hal.science/hal-02015694
https://hal.science/hal-02015694
Autor:
B. Blampey, Philippe Artillan, Grégory Houzet, David Auchere, Cedric Bermond, Thierry Lacrevaz, Bernard Flechet
Publikováno v:
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), May 2018, Brest, France. pp.1-4, ⟨10.1109/SaPIW.2018.8401670⟩
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI), May 2018, Brest, France. pp.1-4, ⟨10.1109/SaPIW.2018.8401670⟩
A wide band (1 GHz–67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of permittivity of insulators used in interconnects networks. Concerning losses, reto-simul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3b7602f53e198618d2aa0993bd9380ab
https://hal.science/hal-01988726
https://hal.science/hal-01988726
Autor:
Philippe Artillan, Grégory Houzet, Khadim Dieng, Yann Lamy, Cedric Bermond, Thierry Lacrevaz, Ossama El Bouayadi, Bernard Flechet
Publikováno v:
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2014, 4 (9), pp.1515-1522. ⟨10.1109/TCPMT.2014.2337511⟩
IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2014, 4 (9), pp.1515-1522. ⟨10.1109/TCPMT.2014.2337511⟩
International audience; This paper deals with the wideband frequency molding material characterization in three dimensions stack of integrated circuits (3-D IC). This material is required as a passivation layer at the top of an element called interpo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e87de620e0b33b98f830e39c26cf6ccd
https://doi.org/10.1109/tcpmt.2014.2337511
https://doi.org/10.1109/tcpmt.2014.2337511
Autor:
Helene Jacquinot, Alexis Farcy, Kevin Morot, Bernard Flechet, Cedric Bermond, Thierry Lacrevaz
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC)
2016 6th Electronic System-Integration Technology Conference (ESTC), Sep 2016, Grenoble, France. pp.1-6, ⟨10.1109/ESTC.2016.7764483⟩
2016 6th Electronic System-Integration Technology Conference (ESTC), Sep 2016, Grenoble, France. pp.1-6, ⟨10.1109/ESTC.2016.7764483⟩
The continuous requirement of higher communication bandwidths in data centers or high performance computers drives the convergence between ASICs and optical I/Os. Combining 3D integration and Si-photonic technologies on a photonic interposer platform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ed032b33c2ca93311e03894b77366fbe
https://hal.archives-ouvertes.fr/hal-02003969
https://hal.archives-ouvertes.fr/hal-02003969