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pro vyhledávání: '"Berens, Judith. V."'
Autor:
Kalha, Curran, Bichelmaier, Sebastian, Fernando, Nathalie K., Berens, Judith. V., Thakur, Pardeep K., Lee, Tien-Lin, Gutiérrez-Moreno, Julio. J., Mohr, Stephan, Ratcliff, Laura E., Reisinger, Michael, Zechner, Johannes, Nelhiebel, Michael, Regoutz, Anna
The binary alloy of titanium-tungsten (TiW) is an established diffusion barrier in high-power semiconductor devices, owing to its ability to suppress the diffusion of copper from the metallisation scheme into the surrounding silicon substructure. How
Externí odkaz:
http://arxiv.org/abs/2102.09845