Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Bentian Jiang"'
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41:2671-2684
Optical proximity correction (OPC) in modern design closures has become extremely expensive and challenging. Conventional model-based OPC encounters performance degradation and large process variation, while aggressive approach such as inverse lithog
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb4a1e054bb3867d0c9c8f5afafda9b7
https://doi.org/10.1109/tcad.2021.3109556
https://doi.org/10.1109/tcad.2021.3109556
Autor:
Xiaopeng Zhang, Jingsong Chen, Fangzhou Wang, Lixin Liu, Evangeline F. Y. Young, Bentian Jiang, Jinwei Liu
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 41:1888-1901
The tremendous growth in deep learning (DL) applications has created an exponential demand for computing power, which leads to the rise of AI-specific hardware. Targeted towards accelerating computation-intensive deep learning applications, AI hardwa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a34ab6d03d9dce221a1515ad24eefdb8
https://doi.org/10.1109/tcad.2021.3096458
https://doi.org/10.1109/tcad.2021.3096458
Publikováno v:
Proceedings of the 59th ACM/IEEE Design Automation Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d938e7273220da76ee97829cda1ffc13
https://doi.org/10.1145/3489517.3530579
https://doi.org/10.1145/3489517.3530579
Autor:
Jinwei Liu, Xiaopeng Zhang, Shiju Lin, Xinshi Zang, Jingsong Chen, Bentian Jiang, Martin D. F. Wong, Evangeline F. Y. Young
Publikováno v:
Proceedings of the 59th ACM/IEEE Design Automation Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b167bb68f5e38f8edbcaa7c85ca55ba9
https://doi.org/10.1145/3489517.3530565
https://doi.org/10.1145/3489517.3530565
Publikováno v:
ISPD
With the continuous shrinkage of device technology node, the tremendously increasing demands for resolution enhancement technologies (RETs) have created severe concerns over the balance between computational affordability and model accuracy. Having r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::054f3d8702efae93356b2e6cec8f99d3
https://doi.org/10.1145/3439706.3447050
https://doi.org/10.1145/3439706.3447050
Autor:
Bentian Jiang, Jingsong Chen, Fangzhou Wang, Evangeline F. Y. Young, Jinwei Liu, Xiaopeng Zhang, Lixin Liu
Publikováno v:
ICCAD
The tremendous growth in deep learning (DL) applications has created an exponential demand for computing power, which leads to the rise of AI-specific hardware. Targeted towards accelerating computation-intensive deep learning applications, AI hardwa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61e4b15110bd610e5052fe30dfbf247d
https://doi.org/10.1145/3400302.3415688
https://doi.org/10.1145/3400302.3415688
Publikováno v:
ICCAD
Optical proximity correction (OPC) for advanced technology node now has become extremely expensive and challenging. Conventional model-based OPC encounters performance degradation and large process variation, while aggressive approach such as inverse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::721c2f73b095b4cf252301e7e78a5af8
https://doi.org/10.1145/3400302.3415704
https://doi.org/10.1145/3400302.3415704
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. :1-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e7029530e51fe574e2898c2da005152
https://doi.org/10.1109/tcad.2022.3232992
https://doi.org/10.1109/tcad.2022.3232992
Publikováno v:
ICCAD
Detailed routing becomes a crucial challenge in VLSI design with shrinking feature size and increasing design complexity. More complicated design rules were added to guarantee manufacturability, which made detailed routing an even harder task to achi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42cd87742f9dd39c5f41d1965b4e38df
https://doi.org/10.1109/iccad45719.2019.8942074
https://doi.org/10.1109/iccad45719.2019.8942074
Autor:
F Y Young Evangeline, Wei Li, Bentian Jiang, Bei Yu, Peishan Tu, Xiaopeng Zhang, Ran Chen, Gengjie Chen
Publikováno v:
DAC
Dummy fill insertion is a mandatory step in modern semiconductor manufacturing process to reduce dielectric thickness variation, and provide nearly uniform pattern density for the chemical mechanical planarization (CMP) process. However, with the con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b23fe79cac0d4c81691efd20c8a730a2
https://doi.org/10.1145/3316781.3317826
https://doi.org/10.1145/3316781.3317826