Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Benoit Foisy"'
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
A bidirectional solid/fluid coupling methodology developed for natural convection [1], [2] has been applied to the case of forced convection. The two-way coupling methodology is compared when using CFD and empirical formulas to determine the heat tra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc724936dcc857144c78430636d88e52
https://doi.org/10.1109/itherm.2019.8757329
https://doi.org/10.1109/itherm.2019.8757329
Autor:
Benoit Foisy, Bijan Borzou, Julien Sylvestre, Stephanie Allard, Eric Duchesne, Papa Momar Souare, Mamadou Kabirou Toure
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
In order to contribute to a better understanding of the relevant thermal phenomena, we have performed a high precision comparison of a microelectronic package cooled by natural convection with experimental data obtained in the Still Air JEDEC configu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0a415d7b63c3dd24582694862acc70a
https://doi.org/10.1109/estc.2018.8546346
https://doi.org/10.1109/estc.2018.8546346
Autor:
Mamadou Kabirou Toure, Benoit Foisy, Stephanie Allard, Eric Duchesne, Julien Sylvestre, Papa Momar Souare
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2018, Toulouse, France. ⟨10.1109/EuroSimE.2018.8369862⟩
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2018, Toulouse, France. ⟨10.1109/EuroSimE.2018.8369862⟩
In order to predict and manage the thermal behavior of microelectronic packages cooled principally by natural convection, a two-way coupling method was developed between a accurate conduction model and a computational fluid dynamics (CFD) simulation.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2af658599ae1f7f2800e28ceb8be89f1
https://doi.org/10.1109/eurosime.2018.8369862
https://doi.org/10.1109/eurosime.2018.8369862
Publikováno v:
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, May 2017, Lake Buena Vista, United States
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, May 2017, Lake Buena Vista, United States
The trend towards multi-die flip chip packaging favors the incorporation of a qualified manufacturingcompatible rework process to remove and replace individual defective die. Inherent to the rework process is an electrical verification step that effe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a4019ec70c97753d7c23fd04214f8410
https://hal.archives-ouvertes.fr/hal-02097251
https://hal.archives-ouvertes.fr/hal-02097251
