Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Benkechkache, Mohamed El Amine"'
The semiconductor industry's rapid advancement pushes conventional two-dimensional technology to its utmost limitations in terms of scaling, performance, and cost factors. These challenges drive the usage of 3D technology in the production of various
Externí odkaz:
http://arxiv.org/abs/2209.02230
Autor:
Pancheri, Lucio, Benkechkache, Mohamed El Amine, Mendicino, Roberto, Xu, Hesong, Dalla Betta, Gian Franco, Verzellesi, Giovanni, Comotti, Daniele, Ratti, Lodovico, Grassi, Marco, Lodola, Luca, Malcovati, Piero, Vacchi, Carla, Fabris, Lorenzo, Manghisoni, Massimo, Valerio, Re, Traversi, Gianluca, Batignani, Giovanni, Bettarini, Stefano, Casarosa, Giulia, Forti, Francesco, Paladino, Antonio, Paoloni, Eugenio, Rizzo, Giuliana, Morsani, Fabio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______3432::2b692eadb653c7163aaf8dd1eb72b4f6
http://hdl.handle.net/11572/149225
http://hdl.handle.net/11572/149225
Publikováno v:
IDT
Current innovations in electronics combine performance, size and cost criteria. Nevertheless, in the all-digital era, the 2D technology and the fabrication of CMOS Integrated Circuit are approaching their ultimate limits. As a result, the use of 3D t
Autor:
Dalla Betta, Gian-Franco, Batignani, Giovanni, Benkechkache, Mohamed El Amine, Bettarini, Stefano, Casarosa, Giulia, Comotti, Daniele, Fabris, Lorenzo, Forti, Francesco, Grassi, Marco, Latreche-Lassoued, Saida, Lodola, Luca, Malcovati, Piero, Manghisoni, Massimo, Mendicino, Roberto, Morsani, Fabio, Paladino, Antonio, Pancheri, Lucio, Paoloni, Eugenio, Ratti, Lodovico, Re, Valerio
Publikováno v:
2014 IEEE Nuclear Science Symposium & Medical Imaging Conference (NSS/MIC); 2014, p1-3, 3p