Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Benjamin Stassen Cook"'
Autor:
Benjamin Stassen Cook, Bichoy Bahr, Ali Kiaei, Baher S. Haroun, Mahmud Chowdhury, Swaminathan Sankaran
Publikováno v:
2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC).
This paper presents a 2.5 GHz bulk acoustic wave (BAW) resonator-based oscillator in a wafer chip scale package (WCSP). Electro-Magnetic coupling is used to eliminate rigid galvanic connections between the BAW die and the CMOS oscillator die. The BAW
Autor:
Waleed Ahmad, Benjamin Stassen Cook, Swaminathan Sankaran, Gerd Schuppener, Hassan H. Ali, Tolga Dinc, Jack Blauert, Domingo G. Garcia
Publikováno v:
2021 IEEE MTT-S International Microwave Symposium (IMS).
This paper presents a low cost, compact, short-reach contactless data link designed for M2M applications requiring a full 360° rotational freedom. Full rotational freedom is enabled by a 16 GHz split-ring resonator (SRR) based near field coupler (NF
Autor:
Trevor Tarsi, Brian E. Goodlin, Danielle Griffith, Ricky A. Jackson, Benjamin Stassen Cook, Jeronimo Segovia-Fernandez, Benyong Zhang, Keegan Martin, Mahmud Chowdhury, Ernest Ting-Ta Yen
Publikováno v:
2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF).
This paper introduces TI's mirror-encapsulated bulk acoustic wave (BAW) resonator technology and two novel system applications. Similar to other BAW resonators, the dual-Bragg acoustic resonator (DBAR) utilizes piezoelectric aluminum nitride (AIN) th
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
This paper outlines the fundamental principles and processing characteristics of realizing application-specific "smart"' microelectronic packages utilizing fully-additive inkjet and 3D printing fabrication technologies. Standard square encapsulants a
Publikováno v:
IEEE Antennas and Wireless Propagation Letters. 15:143-146
This letter presents two high-gain, multidirector Yagi-Uda antennas for use within the 24.5-GHz ISM band, realized through a multilayer, purely additive inkjet printing fabrication process on a flexible substrate. Multilayer material deposition is us
Publikováno v:
IEEE Transactions on Antennas and Propagation. 63:5897-5903
This communication presents a new reconfigurable origami bifilar helical antenna. This antenna can change its operating frequencies by changing its height. Also, analytical equations for the design of such antennas are derived based on an equivalent
Publikováno v:
IEEE Sensors Journal. 15:3156-3163
In this paper, a review of recent improvements on inkjet-printed microfluidic-based tunable/sensing RF systems is reported. The devices, such as Radio Frequency IDentification (RFID) passive wireless tags, coplanar patch antennas, bandstop filters, a
Autor:
Wenjing Su, Manos M. Tentzeris, Christy D. Saintsing, Jo Bito, Anya Traille, John Kimionis, Sangkil Kim, Benjamin Stassen Cook, Jimmy Hester, Taoran Le, Bijan Tehrani, Daniel Lee Revier
Publikováno v:
Proceedings of the IEEE. 103:583-606
Inkjet printing on flexible paper and additive manufacturing technologies (AMT) are introduced for the sustainable ultra-low-cost fabrication of flexible radio frequency (RF)/microwave electronics and sensors. This paper covers examples of state-of-t
Publikováno v:
IEEE Microwave and Wireless Components Letters. 26:419-421
For the first time, high quality factor (Q), meander inductors are demonstrated utilizing inkjet-printing on organic paper substrates. Quality factors of up to 25, which is an order of magnitude greater than previous works, and inductance values of u
Publikováno v:
2017 IEEE MTT-S International Microwave Symposium (IMS).
This work explores the integration of 3D and inkjet printing manufacturing processes with millimeter-wave (mm-wave) wireless packaging technology. Stereolithography-based (SLA) 3D printing methods are discussed for two classes of materials: polymeric