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Autor:
Benedikt Christopher Wolz, Christian Jaremenko, Florian Vollnhals, Lasse Kling, Jan Wrege, Silke Christiansen
Publikováno v:
Engineering Reports, Vol 4, Iss 12, Pp n/a-n/a (2022)
Abstract Through silicon vias (TSVs) are a key enabling technology for interconnection and realization of complex three‐dimensional integrated circuit (3D‐IC) components. In order to perform failure analysis without the need of destructive sample
Externí odkaz:
https://doaj.org/article/a8040407a86c43aa815b7f5b1b36e3e7
