Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Benedikt Christopher Wolz"'
Autor:
Benedikt Christopher Wolz, Christian Jaremenko, Florian Vollnhals, Lasse Kling, Jan Wrege, Silke Christiansen
Publikováno v:
Engineering Reports, Vol 4, Iss 12, Pp n/a-n/a (2022)
Abstract Through silicon vias (TSVs) are a key enabling technology for interconnection and realization of complex three‐dimensional integrated circuit (3D‐IC) components. In order to perform failure analysis without the need of destructive sample
Externí odkaz:
https://doaj.org/article/a8040407a86c43aa815b7f5b1b36e3e7
Autor:
Wolz, Benedikt Christopher, Jaremenko, Christian, Vollnhals, Florian, Kling, Lasse, Wrege, Jan, Christiansen, Silke
Publikováno v:
Engineering Reports; Dec2022, Vol. 4 Issue 12, p1-15, 15p