Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Benedikt Auer"'
Autor:
Francisca Bertin, Jorge Jara-Wilde, Benedikt Auer, Andrés Köhler-Solís, Carolina González-Silva, Ulrich Thomas, Jimena Sierralta
Publikováno v:
Biological Research, Vol 56, Iss 1, Pp 1-16 (2023)
Abstract Background The endoplasmic reticulum (ER) contacts endosomes in all parts of a motor neuron, including the axon and presynaptic terminal, to move structural proteins, proteins that send signals, and lipids over long distances. Atlastin (Atl)
Externí odkaz:
https://doaj.org/article/6c3bafec0287418dbf5661dd86fd3fb5
Publikováno v:
Frontiers in Cell and Developmental Biology, Vol 7 (2019)
Thy-1 is a small membrane glycoprotein and member of the immunoglobulin superfamily of cell adhesion molecules. It is abundantly expressed in many cell types including neurons and is anchored to the outer membrane leaflet via a glycosyl phosphatidyli
Externí odkaz:
https://doaj.org/article/a28d8325a99f43fbafb40cf8f0722837
Autor:
Francisca Bertin, Jorge Jara-Wilde, Benedikt Auer, Andrés Köhler-Solís, Carolina González-Silva, Ulrich Thomas, Jimena Sierralta
Motor neurons are highly dependent on membrane trafficking, in which the endoplasmic reticulum (ER) and its contact sites with endosomes, confer the ER the role of a long-distance communicator. Atlastin (Atl), a large GTPase located on the ER membran
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::268d24866cf282520c09cecb1ce8f48c
https://doi.org/10.1101/2022.09.09.507308
https://doi.org/10.1101/2022.09.09.507308
Autor:
Julian Bravin, Birgit Brandstatter, Elisabeth Brandl, Benedikt Auer, Sebastiaan Kersjes, Niek van Haare, Ayad Ghannam, Hannes Klingler, Philippe Meunier
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
In this work, a new wafer-level 3D packaging technology is developed to enable integration of an ultra-thin QFN-like (quad-flat no-leads) 3D package that targets both effective electrical and thermal properties and a thickness smaller than 200 µm. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::00560d175c449433ca7eee38c862537f
https://doi.org/10.1109/ectc.2019.00276
https://doi.org/10.1109/ectc.2019.00276
Autor:
Faro Hechenberger, Daniel Fridrich, Lorenz Ballauf, Hannah Thiel, Benedikt Auer, Manuel Drost, Stefan Raggl, Paul Scheier, Felix Duensing, Alexander Menzel
Publikováno v:
Applied Surface Science. 538:148042
The ion induced electron emission yield upon Ar+ ion impact at 420 eV was measured for a stainless-steel sample that was partially covered with a 50 nm thick gold layer. The ion induced electron emission yield for the two target materials differs str
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::181457c6b6117ecb39f652b4157e1147
https://doi.org/10.1016/j.apsusc.2020.148042
https://doi.org/10.1016/j.apsusc.2020.148042
Publikováno v:
Frontiers in Cell and Developmental Biology
Thy-1 is a small membrane glycoprotein and member of the immunoglobulin superfamily of cell adhesion molecules. It is abundantly expressed in many cell types including neurons and is anchored to the outer membrane leaflet via a glycosyl phosphatidyli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::6b3e0cb1f0005be2c33e2abdbe81ceac
https://pubmed.ncbi.nlm.nih.gov/30899760
https://pubmed.ncbi.nlm.nih.gov/30899760
Autor:
Andreas Kremling, Anna Goehler, Knut Jahreis, Markus Nees, Benedikt Auerbach, Wolfgang Schmidt-Heck, Öznur Kökpinar, Robert Geffers, Ursula Rinas, Katja Bettenbrock
Publikováno v:
Metabolites, Vol 2, Iss 4, Pp 844-871 (2012)
Metabolism and signalling are tightly coupled in bacteria. Combining several theoretical approaches, a core model is presented that describes transcriptional and allosteric control of glycolysis in Escherichia coli. Experimental data based on microar
Externí odkaz:
https://doaj.org/article/0052896b8f984fbe976ba087b35ee53a
Autor:
Andras Videki, Thomas Widmann, Mario Schernthaner, Norbert Bilewicz, Florian Speer, Christoph Kroll, Andreas Mayr, Hubert Selhofer, Peter Unterwaditzer, Hannes Rieser, Martin Widauer, Daniel Aschenwald, Richard Neumayr, Ruurd Boomsma, Birgit Brandstatter, Benedikt Auer
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Chip-to-wafer hybrid bonding is needed as contact pitch and pad size decrease to the single micrometer range (5 micrometer or lower). Here, classical bonding technologies like themo-compression bonding and flip-chip with mass reflow are no longer suf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5537c82a09e5210915cfb8b5affcd178