Zobrazeno 1 - 10
of 60
pro vyhledávání: '"Ben-Je Lwo"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab137a4fd29a109eadb249ddc253a5c4
https://doi.org/10.1109/ectc51906.2022.00066
https://doi.org/10.1109/ectc51906.2022.00066
Publikováno v:
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f10c225c78f47006cbe3048dddff25b
https://doi.org/10.1109/impact53160.2021.9696482
https://doi.org/10.1109/impact53160.2021.9696482
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:921-926
The parasitic effect inside through-silicon via (TSV) packaging under radio frequency (RF) operation may cause abnormal signals in circuit performance. On the bases of a self-developed deembedding technique, we investigated the high-frequency charact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36d4dc501e7d750d4ac779f969826a19
https://doi.org/10.1109/tcpmt.2018.2890009
https://doi.org/10.1109/tcpmt.2018.2890009
Autor:
Yao-Shing Chen, Ben-Je Lwo
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Flexible thermoelectric (TE) products that convert temperature difference into electrical energy can be used as textile materials to harvest human body heat into electrical power for portable, low-power microelectronic products. To this end, this stu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6226eec1e21fd4bd3dfa51fe577b8c4e
https://doi.org/10.1109/impact50485.2020.9268537
https://doi.org/10.1109/impact50485.2020.9268537
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:27-32
The contact resistance of microbumps in a plastic ball grid array packaging with a through-silicon-via (TSV) structure was characterized. Accordingly, a self-designed TSV daisy-chain circuit was proposed to facilitate the formulation of the measureme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8679669ab389f747a1f1974951f65a01
https://doi.org/10.1109/tcpmt.2016.2627577
https://doi.org/10.1109/tcpmt.2016.2627577
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Thermal warpage creates during fan-out panel level package (FOPLP) manufacturing process and it may causes challenges on subsequent procedures. To this end, finite element analysis (FEA) with element birth and death techniques were performed in this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f81b8f8fd0c72d0e874c0c26eed02830
https://doi.org/10.1109/impact47228.2019.9024980
https://doi.org/10.1109/impact47228.2019.9024980
Autor:
Ben-Je Lwo, Frank M.-S. Lin
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:185-191
Through silicon via (TSV) is the key technology used in 2.5-D and 3-D packaging. Evaluating the reliability of products using this new technology has been challenging because of complex environmental factors. The aim of this paper was to design and i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4ef98569bd50a2115b9d9f590227df9
https://doi.org/10.1109/tcpmt.2015.2513073
https://doi.org/10.1109/tcpmt.2015.2513073
Autor:
Ben-Je Lwo, Yao-Shing Chen
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Based on our previous works, this paper proposes a new measurement methodology to extract the Seebeck coefficients for single layer, thin-film thermoelectric devices developed on different flexible substrates. With the new sandwich-like apparatus des
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c6cd4d0845d698d766fe720df381386
https://doi.org/10.1109/impact.2017.8255930
https://doi.org/10.1109/impact.2017.8255930
Autor:
Ben-Je Lwo, Yao-Shing Chen
Publikováno v:
Coatings
Volume 9
Issue 12
Volume 9
Issue 12
This paper presents the realization of a flexible thermoelectric (TE) generator as a textile fabric that converts human body heat into electrical energy for portable, low-power microelectronic products. In this study, an organic non-toxic conductive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::93fcf4d1252ac6c1c4a83d67bfa6a963
https://doi.org/10.3390/coatings9120831
https://doi.org/10.3390/coatings9120831
Publikováno v:
International Journal of Electronics. 100:1256-1269
Through-silicon via (TSV) is one of the key technologies on three-dimensional integration packaging. In this article, an experimental methodology with circuit models was proposed for electrical characteristic tests on typical TSV structures. To this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60260160696ab20e7156e7a231ed371e
https://doi.org/10.1080/00207217.2012.743079
https://doi.org/10.1080/00207217.2012.743079