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pro vyhledávání: '"Ben Hoi Wai Lui"'
Autor:
Ben Hoi Wai Lui, Timothy Leung, Bernard Baylon, Hector Agtarap, YH Kong, Shi-Wei Ricky Lee, Pompeo Umali
Publikováno v:
Soldering & Surface Mount Technology. 14:46-50
Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead‐free solder joints for various assembly conditions. A five‐leg e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c22d0d7b00cd27d6cd8921915a4af264
https://doi.org/10.1108/09540910210444728
https://doi.org/10.1108/09540910210444728
