Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Beijer, J.G.J."'
Autor:
Beijer, J.G.J., Spoormaker, J.L.
Publikováno v:
In Computers and Structures 2002 80(14):1213-1229
Autor:
Beijer, J.G.J *, Spoormaker, J.L
Publikováno v:
In Polymer June 2000 41(14):5443-5449
Autor:
Gonda, V., Toonder, den, J.M.J., Beijer, J.G.J., Zhang, G.Q., van Driel, W.D., Hoofman, R.J.O.M., Ernst, L.J.
Publikováno v:
Microelectronics and Reliability : an International Journal and World Abstracting Service, 44(12), 2011-2017. Elsevier
More than 65% of IC failures are related to thermal and mechanical problems. For wafer backend processes, thermo-mechanical failure is one of the major bottlenecks. The ongoing technological trends like miniaturization, introduction of new materials,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::1e9a61c82600496ec4d41d37b431c4f7
https://research.tue.nl/nl/publications/522250e2-5ce8-4634-8035-e03cf9e2a427
https://research.tue.nl/nl/publications/522250e2-5ce8-4634-8035-e03cf9e2a427
Publikováno v:
Proceedings of the 4th International Conference on Thermal and Mechanical Simulation and Experiment in Microelectronics and Microsystems, 359-363
STARTPAGE=359;ENDPAGE=363;TITLE=Proceedings of the 4th International Conference on Thermal and Mechanical Simulation and Experiment in Microelectronics and Microsystems
STARTPAGE=359;ENDPAGE=363;TITLE=Proceedings of the 4th International Conference on Thermal and Mechanical Simulation and Experiment in Microelectronics and Microsystems
More than 65% of IC failures are related to thermal and mechanical problems. For wafer backend processes, thermo-mechanical failure is one of the major bottlenecks. The ongoing technological trends like miniaturization, introduction of new materials,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=narcis______::7aeecf171b9d714747cb383c51543798
https://research.tue.nl/nl/publications/005b9e6f-8816-40c7-95a3-5e40eaa5ba78
https://research.tue.nl/nl/publications/005b9e6f-8816-40c7-95a3-5e40eaa5ba78
Publikováno v:
EuroSime 2006 - 7th International Conference on Thermal, Mechanical & Multiphysics Simulation & Experiments in Micro-Electronics & Micro-Systems; 2006, p1-7, 7p
Publikováno v:
2005 6th International Conference on Electronic Packaging Technology; 2005, p94-98, 5p
Modelling methodology for linear elastic compound modelling versus visco-elastic compound modelling.
Publikováno v:
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Micro-Electronics & Micro-Systems, 2005; 2005, p483-489, 7p
Autor:
Beijer, J.G.J., Janssen, J.H.J., Bressers, H.J.L., van Driel, W.D., Jansen, K.M.B., Yang, D.G., Zhang, G.Q.
Publikováno v:
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Micro-Electronics & Micro-Systems, 2005; 2005, p168-174, 7p
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