Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Behnam Khorramdel"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 6, Pp 34-40 (2018)
In this paper, an additive method to make electrical contacts in SOI MEMS devices with aerosol jet printing is introduced. Small grooves were etched to the frame of MEMS accelerometer in the same step with the active structure release. Aluminum ink w
Externí odkaz:
https://doaj.org/article/4caf24ba0dc84edd8d6b0934834a598f
Autor:
Markus Tuomikoski, Aleksis Leinonen, Mohammad H. Behfar, Matti Mäntysalo, Elina Jansson, Behnam Khorramdel, Arttu Korhonen
Publikováno v:
Behfar, M H, Khorramdel, B, Korhonen, A, Jansson, E, Leinonen, A, Tuomikoski, M & Mäntysalo, M 2021, ' Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics ', Advanced Engineering Materials, vol. 23, no. 12, 2100264 . https://doi.org/10.1002/adem.202100264
Accelerating progress in printed electronics technology transforms the future of the manufacturing process in industrial applications, consumer electronics, and healthcare products. However, real-life applications demand for circuits and systems that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a1aef5a8ddae2ff453cbd65cbae3fc64
https://cris.vtt.fi/ws/files/53434845/adem.202100264.pdf
https://cris.vtt.fi/ws/files/53434845/adem.202100264.pdf
Autor:
Jukka Vanhala, Mari Honkanen, Behnam Khorramdel, Mahmoud Mosallaei, Pekka Iso-Ketola, Matti Mäntysalo
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-6
Electronic devices that are deformable in arbitrary directions would open up a new generation of applications such as epidermal electronics, implantable electronics and soft robotics. It would not be feasible to fabricate them with conventional rigid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ae8210cdfe05e6cee1aeacd245710a52
https://doi.org/10.4071/2017-nor-mosallaei
https://doi.org/10.4071/2017-nor-mosallaei
Publikováno v:
Scientific Reports
Scientific Reports, Vol 10, Iss 1, Pp 1-11 (2020)
Scientific Reports, Vol 10, Iss 1, Pp 1-11 (2020)
Stretchable electronics promise to extend the application range of conventional electronics by enabling them to keep their electrical functionalities under system deformation. Within this framework, development of printable silver-polymer composite i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid_dedup__::bc37c1374a29c549ef9580d00306a198
https://trepo.tuni.fi/handle/10024/127478
https://trepo.tuni.fi/handle/10024/127478
Recent advances in materials science and structural design have changed electronic applications from being bulky and rigid objects to small and soft products that have emerged for a wide range of applications, especially human-related products for wh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::faaaafe30b3d44922a6516387e8f0869
https://trepo.tuni.fi/handle/10024/127336
https://trepo.tuni.fi/handle/10024/127336
Publikováno v:
Lecture Notes in Mechanical Engineering ISBN: 9783030410568
Stretchable electronic systems employ a combination of extremely deformable substrates with electrically conductive inks printed on their surface, on which components are connected. The absence of solid metal as conductive material greatly enhances t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e28edafe330ef558899802e624824456
https://doi.org/10.1007/978-3-030-41057-5_61
https://doi.org/10.1007/978-3-030-41057-5_61
Publikováno v:
Khorramdel, B, Kraft, T M & Mäntysalo, M 2017, ' Inkjet printed metallic micropillars for bare die flip-chip bonding ', Flexible and Printed Electronics, vol. 2, no. 4, 045005 . https://doi.org/10.1088/2058-8585/aa9171
Inkjet printed metal micropillars have been developed to help meet the demands for novel and highly adaptable microelectronics fabrication processes. The digitally printed silver pillar arrays in this study have been utilized in place of wafer-level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::18e0cbe1d25e3ddc4ba74ccfe479be72
https://trepo.tuni.fi/handle/10024/126327
https://trepo.tuni.fi/handle/10024/126327
In this paper, we have studied the print parameter effects on electrohydrodynamic inkjet (E-jet) resolution using statistical analysis. In order to make the E-jet manufacturing process feasible, the effect of printing parameters on the ejected drople
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d08e08a5162f5c3910c952f55c5ae90
https://trepo.tuni.fi/handle/10024/126249
https://trepo.tuni.fi/handle/10024/126249
Autor:
Thorbjörn Ebefors, Mika-Matti Laurila, Frank Niklaus, Behnam Khorramdel, Gustaf Mårtensson, Jessica Liljeholm, Toni Juhani Lammi, Matti Mäntysalo
Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed nex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30335b99234be15283f00137dff4b30c
https://trepo.tuni.fi/handle/10024/126328
https://trepo.tuni.fi/handle/10024/126328
The additive nature and high resolution of electrohydrodynamic inkjet (E-jet) printing can be utilized for manufacturing micrometer scale conductive tracks such as those required in the high-density redistribution layers (RDLs) of silicon interposers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::093d4d882b7e3f02131343d23a9d9c11
https://trepo.tuni.fi/handle/10024/126053
https://trepo.tuni.fi/handle/10024/126053