Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Bee-Kim Hong"'
Autor:
Jens Hahn, Bee Kim Hong, Marcus Dankelmann, Heiko Estel, Mario Lamm, Rainer Scheibel, Markus Czekalla, Maik Stegemann, Eric Neubert, Jens Schneider, Michael Renner
Publikováno v:
SPIE Proceedings.
The use of TiN-Hard masks for Cu metal layer patterning has become a common technique for trench first metal hard mask (TFMH) back end of line (BEOL) integration schemas. Resist rework influences the chemical and physical behavior of the TiN hard mas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13dfe25d177326aa4b65c781ed326a91
https://doi.org/10.1117/12.2045307
https://doi.org/10.1117/12.2045307
Autor:
Christoph Noelscher, Marcel Heller, Bee-Kim Hong, Matthias Markert, Ulrich Egger, Franck Jauzion-Graverolle, Dietmar Temmler
Publikováno v:
Optical Microlithography XXI.
Double patterning based on litho-etch-litho-etch techniques requires the fabrication of small lines or of small spaces after first patterning. If spacer techniques are used for pitch fragmentation small lines are needed as carrier in dense arrays. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e59401a3ae90cc94133e3f24c4af205
https://doi.org/10.1117/12.772750
https://doi.org/10.1117/12.772750
Autor:
Christoph Noelscher, Marcel Heller, Matthias Markert, Dietmar Temmler, Franck Jauzion-Graverolle, Nicolo´ Morgana, Ulrich Scheler, Bee-Kim Hong, Ulrich Egger, Vadim Timoshkov, Mirko Vogt
Publikováno v:
Journal of Micro/Nanolithography, MEMS & MOEMS; Jan2009, Vol. 8 Issue 1, p011005-011005-15, 1p