Packaging tradeoff for high speed device integrations

Autor: Haentjens, Benoit, Desruelles, Guillaume, Gérald, Chrétien, Leborgne, Alain, Haentjens, Yan, Dupuy, Jean-Yves, Felipe, Jorge, Konczykowska, Agnieszka, Beauvisage, Ikram, Delemme, Romain, Martin, Didier, Bila, Stéphane, Frigui, Kamel, Ngoho Moungoho, Stéphane Samuel, Frigui, Bouchra, Mardoyan, Haik

Publikováno v: International Microelectronics Assembly and Packaging Society
International Microelectronics Assembly and Packaging Society, 2015, Orlando, United States

International audience

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::f866779f17b53ef5b347ea6f2ed9851c
https://hal-unilim.archives-ouvertes.fr/hal-01302221