Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Bastien Letowski"'
Publikováno v:
Electronics
Electronics, Penton Publishing Inc., 2020, 9 (11), pp.1832. ⟨10.3390/electronics9111832⟩
Electronics, Vol 9, Iss 1832, p 1832 (2020)
Volume 9
Issue 11
Electronics, Penton Publishing Inc., 2020, 9 (11), pp.1832. ⟨10.3390/electronics9111832⟩
Electronics, Vol 9, Iss 1832, p 1832 (2020)
Volume 9
Issue 11
International audience; Nowadays, communication and web services are part of our lives, including education, and e-learning applications are used more and more. However, teaching in engineering sciences requires an important amount of practical exper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e023182cd02e140b95965ff2ecb9fcea
https://hal-cnrs.archives-ouvertes.fr/hal-03126482/file/MDPIelectronics20(3).pdf
https://hal-cnrs.archives-ouvertes.fr/hal-03126482/file/MDPIelectronics20(3).pdf
Publikováno v:
ICERI 2019
ICERI 2019, Nov 2019, Seville, Spain
12th Int. Conf. of Education, Research and Innovation (ICERI 2019)
12th Int. Conf. of Education, Research and Innovation (ICERI 2019), Nov 2019, Seville, Spain. pp.5726-5731
HAL
ICERI 2019, Nov 2019, Seville, Spain
12th Int. Conf. of Education, Research and Innovation (ICERI 2019)
12th Int. Conf. of Education, Research and Innovation (ICERI 2019), Nov 2019, Seville, Spain. pp.5726-5731
HAL
International audience; To answer to the widespread use of computers and internet, our project (Laborem) is to implement new tools for teachers and learners as remote laboratories, the objective is to increase the student motivation. A robotic arm, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c01a725a3f8feea5542eba71256f475d
https://hal.archives-ouvertes.fr/hal-02405954
https://hal.archives-ouvertes.fr/hal-02405954
Autor:
Julie Widiez, Bastien Letowski, Pierre Perreau, Jean-Christophe Crebier, Perceval Coudrain, Kremena Vladimirova, Gregory Enyedi, Nicolas Rouger
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, France. pp.1251-1257, ⟨10.1109/ECTC.2018.00193⟩
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, France. pp.1251-1257, ⟨10.1109/ECTC.2018.00193⟩
International audience; This paper presents a wafer-level pre-packagingtechnology for power devices. The concept consists in theimplementation of a thick 3D patterned copper leadframeensuring the interconnections of the power devices amongthem or wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02f98f81ae7cfcdd1209324739ad54c4
https://cea.hal.science/cea-02185324
https://cea.hal.science/cea-02185324
Publikováno v:
HAL
11th Annual Int. Conf. Education, Research and Innovation (ICERI2018)
11th Annual Int. Conf. Education, Research and Innovation (ICERI2018), Nov 2018, Seville, Spain
11th Annual Int. Conf. Education, Research and Innovation (ICERI2018)
11th Annual Int. Conf. Education, Research and Innovation (ICERI2018), Nov 2018, Seville, Spain
International audience; The development in numerical technologies modifies and shapes interests of today's students but it also makes possible the emergence of new pedagogical tools as remote laboratories. The instrumentation of technological systems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fd41b72f0da9015ceb83af903a23e4b4
https://hal-univ-pau.archives-ouvertes.fr/hal-01910013
https://hal-univ-pau.archives-ouvertes.fr/hal-01910013
Autor:
William Vandendaele, Jean-Christophe Crebier, Julie Widiez, Bruno Imbert, Bastien Letowski, Marc Rabarot, Nicolas Rouger
Publikováno v:
Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on
Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
HAL
Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on, Jun 2016, Prague, Czech Republic
HAL
International audience; This paper presents a wafer-level fabrication process of 3D power module based on 8-inch wafer devices and 8-inch metallic bulk leadframe. This approach relies on the intermixing of the packaging process with the front-end fab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::798ba83d43471296c289c23e21f1fd64
https://doi.org/10.1109/ispsd.2016.7520796
https://doi.org/10.1109/ispsd.2016.7520796
Autor:
Bastien Letowski, Julie Widiez, Nicolas Rouger, Marc Rabarot, William Vandendaele, Bruno Imbert, Jean-Christophe Crebier
Publikováno v:
HAL
Symposium de Genie Electrique
Symposium de Genie Electrique, Jun 2016, Grenoble, France
Symposium de Genie Electrique
Symposium de Genie Electrique, Jun 2016, Grenoble, France
International audience; Nous présentons dans ce papier l'état d'avancement d'une approche d'assemblage collectif en 3D de modules électroniques de puissance, basée sur des étapes technologiques de fabrication à l'échelle de la plaque (200 mm d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::18f077aa883672fecbb8c187e1ffbbaa
https://hal.archives-ouvertes.fr/hal-01361603
https://hal.archives-ouvertes.fr/hal-01361603
Publikováno v:
HAL
France, N° de brevet: 16/54036. 2016
France, N° de brevet: 16/54036. 2016
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::2d41b40930a89c5a3bfd65bce5895eab
https://hal.archives-ouvertes.fr/hal-01518798
https://hal.archives-ouvertes.fr/hal-01518798