Zobrazeno 1 - 10
of 161
pro vyhledávání: '"Bart Vandevelde"'
Publikováno v:
Micromachines, Vol 3, Iss 1, Pp 150-167 (2012)
In this paper, a general methodology for the dynamic study of electrostatically actuated droplets is presented. A simplified 1D transient model is developed to investigate the transient response of a droplet to an actuation voltage and to study the e
Externí odkaz:
https://doaj.org/article/729510334bfc454da61b3a10f4b5d614
Autor:
Reza Moloudi, Tobias Grün, Willem Verleysen, Bart Vandevelde, Silke G.C. Cleuren, Daniel May, Bernhard Wunderle
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8e434fe6889b2106484a739dfe478e0
https://doi.org/10.1109/eurosime56861.2023.10100758
https://doi.org/10.1109/eurosime56861.2023.10100758
Autor:
Bart Vandevelde, Riet Labie, Ralph Lauwaert, Rainer Dudek, Przemyslaw Gromala, Michael Eichorst
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb036dc1720277aed4d5d75030e9f27b
https://doi.org/10.1109/eurosime56861.2023.10100841
https://doi.org/10.1109/eurosime56861.2023.10100841
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c4aacd9a9af10f193d4b35885902064
https://doi.org/10.1109/eurosime56861.2023.10100821
https://doi.org/10.1109/eurosime56861.2023.10100821
Autor:
Bart Vandevelde, Marnix Van De Slyeke, Alexia Coulon, Chinmay Nawghane, Maarten Cauwe, Stan Heltzel
Publikováno v:
CEAS SPACE JOURNAL
Despite its introduction over 3 decades ago, designing, manufacturing and testing of high-density interconnect (HDI) printed circuit boards (PCBs) remains a topic of discussion. A plethora of advanced manufacturing processes is used to realize HDI PC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fab89bee5af7496b95b0c3827c20ed4c
https://doi.org/10.1007/s12567-021-00403-2
https://doi.org/10.1007/s12567-021-00403-2
Autor:
Bart Vandevelde, Chinmay Nawghane, Rainer Dudek, Ralf Doring, Jens Schindele, Przemyslaw Gromala
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5890fcacf82d6d5df6040a52b385e6c
https://doi.org/10.1109/eurosime54907.2022.9758850
https://doi.org/10.1109/eurosime54907.2022.9758850
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c2dfd64e25b11f741cd078e65bb7209
https://doi.org/10.1109/eurosime54907.2022.9758918
https://doi.org/10.1109/eurosime54907.2022.9758918
Autor:
Stan Heltzel, Maarten Cauwe, Erwin Bosman, Marnix Van De Slyeke, Alexia Coulon, Chinmay Nawghane, Joachim Verhegge, Bart Vandevelde
Publikováno v:
JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING
High-density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality of modern integrated circuits such as field-programmable ga
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dd29e2859b65a5ac1f2b27edcb2cacdb
https://doi.org/10.4071/imaps.1212898
https://doi.org/10.4071/imaps.1212898
ispartof: 2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) ispartof: 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74548b2275ff4a9ea476ba839082d802
https://lirias.kuleuven.be/handle/20.500.12942/704649
https://lirias.kuleuven.be/handle/20.500.12942/704649
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
SnBi based solder alloys become an interesting alternative for standard SnAgCu as they can be used to solder components at much lower temperature. The typically 50°C lower solder reflow temperature is less damaging for PCB and components, and also p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2fac97b226e7de4521cf91806562b89a
https://doi.org/10.1115/ipack2021-73456
https://doi.org/10.1115/ipack2021-73456