Zobrazeno 1 - 10
of 45
pro vyhledávání: '"Bart Allaert"'
Autor:
Paula Veske-Lepp, Bjorn Vandecasteele, Filip Thielemans, Vera De Glas, Severine Delaplace, Bart Allaert, Kurt Dewulf, Annick Depré, Frederick Bossuyt
Publikováno v:
Sensors, Vol 24, Iss 14, p 4624 (2024)
Electronic textiles (e-textiles) are a branch of wearable technology based on integrating smart systems into textile materials creating different possibilities, transforming industries, and improving individuals’ quality of life. E-textiles hold va
Externí odkaz:
https://doaj.org/article/3365f6d1ae2c4397abd1ece912ad2a9e
Publikováno v:
ARKIVOC, Vol 2005, Iss 1, Pp 92-97 (2005)
Externí odkaz:
https://doaj.org/article/6b4c194e2e67495c8dc7339cba30d5ef
Publikováno v:
Corrosion Engineering, Science and Technology. 55:562-573
In this work, hot-dip galvanised steel wires were exposed in Belgium and Indonesia for 4.5 years and correlation of corrosion products formed on the exposed wires with their corrosion properties was studied. Corrosion products were identified with lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::09846e02c7681ca33ebe1fb509a0f0f5
https://doi.org/10.1080/1478422x.2020.1763685
https://doi.org/10.1080/1478422x.2020.1763685
Publikováno v:
Journal of The Electrochemical Society. 165:C246-C257
Electrochemical impedance spectroscopy (EIS) is a very popular technique to investigate the corrosion behavior of metals and alloys in electrolytes. To interpret the EIS data, an equivalent electrical circuit (EEC) is built and the corrosion behavior
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4ecaa9ea114de4675684c4ad3e5f6b6
https://doi.org/10.1149/2.0741805jes
https://doi.org/10.1149/2.0741805jes
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9caa99dda3b89f37183922e5af839a8b
https://doi.org/10.1016/j.microrel.2017.04.008
https://doi.org/10.1016/j.microrel.2017.04.008
Autor:
Riet Labie, Davy Pissoort, Jan Mehner, Ralph Lauwaert, Filip Vanhee, Chinmay Nawghane, Bart Allaert, Bart Vandevelde, Ingrid De Wolf
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper is aimed at researching the impact of vibrations on chip scale packages (CSPs) assembled on a printed circuit board (PCB) and exploring finite element technique to investigate PCB assembly under vibration load. Importance of experimental m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd779f7d07692f21dfdcc3375f2e0e3
https://doi.org/10.1109/eurosime.2018.8369950
https://doi.org/10.1109/eurosime.2018.8369950
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A modified Charpy impact testing tool is used for the characterization of brittle fractures at the solder — board finish transition. The application of an accelerometer on the hammer allows to extract additional impact parameters which characterize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a50e9cdf748197d18a5df946b9a61cd
https://doi.org/10.1109/eurosime.2018.8369920
https://doi.org/10.1109/eurosime.2018.8369920
Autor:
Riet Labie, Geert Willems, Daniel Werkhoven, Mike Vogeleer, Bart Allaert, Bart Vandevelde, Wesley van Meensel
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
An electronic test module is designed in order to monitor field failures of board assembly interconnections while simultaneously measuring the environmental loading conditions. The test module is built-in on the ceiling of a daily driving bus. During
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b517fc04cbe2af1ae8decbbfb361d59e
https://doi.org/10.1109/eurosime.2017.7926267
https://doi.org/10.1109/eurosime.2017.7926267
Autor:
Bart Vandevelde, Johan De Baets, Bart Allaert, Filip Vanhee, Geert Willems, Davy Pissoort, Ralph Lauwaert, Riet Labie, Lieven Degrendele
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::62d8152507a0b79bc919fbcf066b25c9
https://lirias.kuleuven.be/handle/123456789/603652
https://lirias.kuleuven.be/handle/123456789/603652
Autor:
Viktor V. Zhdankin, Victor N. Nemykin, Francis Verpoort, Christian V. Stevens, Nicolai Dieltiens, Bart Allaert, Diederica D. Claeys
Publikováno v:
European Journal of Organic Chemistry. 2018:3372-3372
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14a20873e5797f554ef2bcae970c9c3d
https://doi.org/10.1002/ejoc.201800986
https://doi.org/10.1002/ejoc.201800986