Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Barry Wang"'
Autor:
Katherine Sieg, Christopher R. Carr, Karsten Schaefer, M. F. Chen, Christopher L. Borst, David Skilbred, Jong-heun Lim, Kosta Culafi, Milo Tallon, Norman Fish, Frank Robertson, Chulgi Song, John Hagwood, Anne-Sophie Larrea, Angelo Alaestante, Mark Kelling, ChungJu Yang, Denis Sullivan, WenLi Collision, Nithin Yathapu, Hsi-Wen Liu, Yii-Cheng Lin, Cheng-Chung Chien, Erin Fria, Regina Swaine, Gerard Stapf, Dan Franca, BumKi Moon, K. K. W. Lee, Bruce Gall, Jamie Prudhomme, Yu-Lieh Fu, Alexander Bialy, Stock Chang, Shannon Dunn, Michael Bryant, Lin Pinyen, Huey-Ming Wang, Joe Maniscalco, Richard Conti, Rand Cottle, Barry Wang, Steven Smith, Sun-OO Kim
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
At 450mm wafer area, the first Cu BEOL module process was demonstrated with a single damascene structure using low-k ILD, TiN metal hard mask and guided 20nm half-pitched lamella BCP DSA patterning. It showed the potential opportunities, technical fe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16f5a6641fe5a8a4871bd779ed63e8be
https://doi.org/10.1109/iitc-amc.2016.7507638
https://doi.org/10.1109/iitc-amc.2016.7507638
Publikováno v:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
There are many excellent film properties of Titanium Nitride, such as high hardness, high corrosion resistance, good conductivity, low friction coefficient and a bright, golden color. In the past couple of years, it has been always used as barrier la
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::daf40e9a322b8c15e8f858f187bce4ff
https://doi.org/10.1109/asmc.2016.7491114
https://doi.org/10.1109/asmc.2016.7491114