Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Barry Saville"'
Autor:
Chen He, Paul Grosch, Onder Anilturk, Joyce Witowski, Carl Ford, Rahul Kalyan, John C. Robinson, David W. Price, Jay Rathert, Barry Saville, Dave Lee
Publikováno v:
2022 IEEE International Test Conference (ITC).
Autor:
Barry Saville, Mike von den Hoff, Oreste Donzella, Thomas Groos, Chet Lenox, Alex Lim, John C. Robinson, Kara Sherman, Price David W, Justin Lach, Jay Rathert
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
The semiconductor content of automobiles is growing rapidly in applications where quality is of paramount importance, and automotive manufacturers have taken the lead in driving a “Zero Defect” mentality into their supply chain. The motivation be
Publikováno v:
Goldschmidt Abstracts.
Publikováno v:
Web of Science
This paper describes a novel methodology for identifying pinholes (defects in thin films) in an amorphous silicon (a-Si) film using a KLA Surfscan® SP5 laser scattering-based unpatterned wafer inspection system. Inherent to the deposition mechanism,
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII.
As technology nodes advance, the need for higher sensitivity optical inspection to identify critical defects has become extremely important for technology development. However, more sensitive optical inspection can induce more nuisance and hence more
Publikováno v:
2019 Electron Devices Technology and Manufacturing Conference (EDTM).
Computational simulations offer a cost-effective way to peek into future challenges in wafer manufacturing. In this paper, a variety of simulation methods will be discussed, including their ability to better predict process changes and the implicatio
Defect detection strategies and process partitioning for SE EUV patterning (Conference Presentation)
Autor:
Nelson Felix, Barry Saville, Corey Lemley, Bassem Hamieh, Christopher F. Robinson, Shinichiro Kawakami, Jeffrey C. Shearer, Chet Lenox, Yann Mignot, Takeshi Shimoaoki, Eric Liu, Hiroshi Ichinomiya, Koichiro Tanaka, Ankit Jain, Koichi Hontake, Shravan Matham, Heungsoo Choi, John C. Arnold, Luciana Meli, Anuja De Silva, Benjamin D. Briggs, Ko Akiteru, Hashimoto Yusaku, Lior Huli, Akiko Kai, Dave Hetzer, Karen Petrillo
Publikováno v:
Extreme Ultraviolet (EUV) Lithography IX.
The key challenge for enablement of a 2nd node of single-expose EUV patterning is understanding and mitigating the patterning-related defects that narrow the process window. Typical in-line inspection techniques, such as broadband plasma (291x) and e
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
As design rules shrink, semiconductor manufacturing becomes more complex which leads to a huge increase in the defects which could cause a non-yielding die. Process control and inline defect analysis becomes widely relevant to help shorten the learni
Autor:
Chet Lenox, Bassem Hamieh, Corey Lemley, Hiroshi Ichinomiya, Christopher F. Robinson, Ankit Jain, Ko Akiteru, Yann Mignot, Lior Huli, Karen Petrillo, Jeffrey C. Shearer, Shinichiro Kawakami, Anuja De Silva, Akiko Kai, Takeshi Shimoaoki, Koichiro Tanaka, Benjamin D. Briggs, Eric Liu, Barry Saville, John C. Arnold, Shravan Matham, Koichi Hontake, Hashimoto Yusaku, Heungsoo Choi, Luciana Meli, Dave Hetzer, Nelson Felix
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 18:1
The key challenge for enablement of a second node of single-expose EUV patterning is understanding and mitigating the patterning-related defects that narrow the process window. Typical in-line inspection techniques, such as broadband plasma and e-bea
Autor:
Barry Saville
Publikováno v:
Canadian Journal of Plant Pathology. 39:384-384