Zobrazeno 1 - 10
of 65
pro vyhledávání: '"Barry J. Rubin"'
Autor:
Kaustav Banerjee, Barry J. Rubin, Chuan Xu, Alain Caron, Alina Deutsch, Li Jun Jiang, Howard H. Smith, A J Weger
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:777-786
To reduce the product development time and achieve first-pass silicon success, fast and accurate estimation of very-large-scale integration (VLSI) interconnect, packaging and 3DI (3D integrated circuits) thermal profiles has become important. Present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7fcdd5f399df82fff27807efa81cf04
https://doi.org/10.1109/tadvp.2010.2090348
https://doi.org/10.1109/tadvp.2010.2090348
Autor:
Barry J. Rubin
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:828-838
This paper describes techniques and advances for mesh generation and refinement for the analysis of electrical package structures. After a brief review of meshing techniques, a physically based justification is provided for the basic elements of grid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b0d9415a320fcf47b1b87d9751407c3
https://doi.org/10.1109/tadvp.2010.2052360
https://doi.org/10.1109/tadvp.2010.2052360
Publikováno v:
IEEE Transactions on Antennas and Propagation. 57:3136-3146
A powerful technique for solving electromagnetic (EM) surface integral equations (SIEs) for inhomogenous objects by the method of moments (MoM) involves the well-known Rao-Wilton-Glisson (RWG) basis function to represent the electric current and, for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::307d8aea6ffb39fb9269a57bd95a70ab
https://doi.org/10.1109/tap.2009.2028622
https://doi.org/10.1109/tap.2009.2028622
Autor:
J.D. Morsey, L. Eisenberg, Barry J. Rubin, Alina Deutsch, C.W. Surovic, Li Jun Jiang, J.P. Libous
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:288-294
Presented here are results and recommendations for reducing coupling between adjacent power islands based on full-wave simulations of a HyperBGA SCM (single-chip module). These simulations highlight the use of IBM's internally developed accelerated f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e8e4b3616848de4de3062bd05a3acb10
https://doi.org/10.1109/tadvp.2007.896005
https://doi.org/10.1109/tadvp.2007.896005
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:11-20
A new technique is described for reducing computational complexity and improving accuracy of combined power distribution and interconnect noise prediction for wide, on-chip data-buses. The methodology uses lossy transmission-line power-blocks with fr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e040e6009f0cd7b53ea013f7ad8f530e
https://doi.org/10.1109/tadvp.2005.862647
https://doi.org/10.1109/tadvp.2005.862647
Autor:
Barry J. Rubin, G.V. Kopcsay, Bruce J. Chamberlin, T.-M. Winkel, George A. Katopis, C.W. Surovic, Roger S. Krabbenhoft, Alina Deutsch
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:4-12
In this paper, the self-consistent, frequency-dependent dielectric constant epsivr(f) and dielectric loss tandelta(f) of several materials are determined over the range 2 to 30 GHz using a short-pulse propagation technique and an iterative extraction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d0718171394f56f0543899599a09790
https://doi.org/10.1109/tadvp.2004.841679
https://doi.org/10.1109/tadvp.2004.841679
A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis
Publikováno v:
IEEE Transactions on Advanced Packaging. 27:71-78
This paper describes a methodology for global on-chip interconnect modeling and analysis using frequency-dependent multiconductor transmission lines. The methodology allows designers to contain the complexity of series impedance computation by transf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2c558c6973d2a817baa16fe8642c5b7
https://doi.org/10.1109/tadvp.2004.825478
https://doi.org/10.1109/tadvp.2004.825478
Autor:
Barry J. Rubin, Robert H. Dennard, Wiren D. Becker, T. Gallo, L.M. Terman, R.P. Dunne, Howard H. Smith, Phillip J. Restle, George A. Katopis, D.R. Knebel, Gerard V. Kopcsay, George Anthony Sai-Halasz, Paul W. Coteus, C.W. Surovic, Alina Deutsch, Byron L. Krauter, Keith A. Jenkins
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 45:1836-1846
Short, medium, and long on-chip interconnections having linewidths of 0.45-52 /spl mu/m are analyzed in a five-metal-layer structure. We study capacitive coupling for short lines, inductive coupling for medium-length lines, inductance and resistance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6626ea00cc442c6620ad368ef1f3541
https://doi.org/10.1109/22.641781
https://doi.org/10.1109/22.641781
Autor:
G.V. Kopcsay, C.W. Surovic, Barry J. Rubin, Alina Deutsch, T. Gallo, R.H. Dennard, L.M. Terman, R.P. Dunne
Publikováno v:
IBM Journal of Research and Development. 39:547-567
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29d7b9c74f7587f8e1c1f2acbfb73b6e
https://doi.org/10.1147/rd.395.0547
https://doi.org/10.1147/rd.395.0547
Autor:
Barry J. Rubin
Publikováno v:
IEEE Transactions on Antennas and Propagation. 41:269-277
A new set of subsectional basis functions is described for calculating the full-wave solution for structures composed of finite-sized dielectrics and conductors. The basis functions explicitly satisfy the physical condition that no polarization charg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1452e31a1f761f31c18dc3a368590f95
https://doi.org/10.1109/8.233137
https://doi.org/10.1109/8.233137