Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Barry Bonitz"'
Autor:
Robert Gideon Wodnicki, Charles Gerard Woychik, Glen Thomas, Bill Burdick, Rayette Ann Fisher, Scott Cogan, Barry Bonitz, Lowell Scott Smith, Xuefeng Zhuang, Kai Erik Thomenius, Pierre Khuri-Yakub, Der-Song Lin, Todd Davies
Publikováno v:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. 61:1086-1100
Mosaic annular arrays (MAA) based on reconfigurable array (RA) transducer electronics assemblies are presented as a potential solution for future highly integrated ultrasonic transducer subsystems. Advantages of MAAs include excellent beam quality an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6900564a68679b7ea3e7e9a971920e5b
https://doi.org/10.1109/tuffc.2014.3009
https://doi.org/10.1109/tuffc.2014.3009
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000618-000634
The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db206e81d03cc0c502087120328ac620
https://doi.org/10.4071/2013dpc-tp12
https://doi.org/10.4071/2013dpc-tp12
Publikováno v:
International Symposium on Microelectronics. 2013:000531-000537
The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e1049e42db5424ca9ae4970a68fca4ec
https://doi.org/10.4071/isom-2013-wa43
https://doi.org/10.4071/isom-2013-wa43
Autor:
Barry Bonitz, Rabindra N. Das, Mark D. Poliks, John M. Lauffer, Francesco Marconi, Voya R. Markovich, Bill Wilson, Frank D. Egitto
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
This paper presents 3D-interconnect technology to produce a variety of structures and packages suitable for high end electronics. 3D-interconnect can join different size multiple rigid structures for rigid-rigid constructions. For example, a high den
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3e80129f456aca53a0d8e247bdb2111
https://doi.org/10.1109/ectc.2012.6249007
https://doi.org/10.1109/ectc.2012.6249007
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
This paper discusses a new 3D “Package-Interposer-Package” (PIP) solution suitable for combining multiple memory, ASICs, stacked die, stacked packaged die, etc., into a single package. Recent work on interposers to join multiple packages is highl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11229a98b3c61140f6791ab8cc9bca3c
https://doi.org/10.1109/ectc.2011.5898577
https://doi.org/10.1109/ectc.2011.5898577