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pro vyhledávání: '"Barry, M. Cook"'
Autor:
Barry M. Cook, Paul Walker
Publikováno v:
Acta Astronautica. 61:243-249
We consider the opportunities for combining the best of SpaceWire, such as modularity, high speed, low latency, fault tolerance, and ease of implementation, with the vast experience of protocol design that has been implemented on Ethernet. We conside
Autor:
Paul Walker, Barry M. Cook
Publikováno v:
Acta Astronautica. 61:250-256
We consider the software issues involved in combining the best of SpaceWire, such as modularity, high speed, low latency, fault tolerance, and ease of implementation, with the vast experience of protocol design that has been implemented on Ethernet.
Autor:
Barry M. Cook
Publikováno v:
Microprocessors and Microsystems. 21:421-428
IEEE standard 1355 (1995) describes several transmission schemes for high-speed, low-latency data communications. One scheme, that employing Data-Strobe encoding, provides robust communications at up to about 200 Mb/s. The low-level protocols can be
Publikováno v:
A Combined Data and Power Management Infrastructure ISBN: 9783642355561
This chapter provides the technical description of the system’s I/O-Boards and the CCSDS-Boards for telecommand decoding and telemetry encoding. The approach for these two OBC components is a common design for the printed circuit boards of both boa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79aa1a6af0ed93cac23c18f04589c0de
https://doi.org/10.1007/978-3-642-35557-8_3
https://doi.org/10.1007/978-3-642-35557-8_3
Autor:
Paul Walker, Barry M. Cook
Publikováno v:
57th International Astronautical Congress.
We consider the opportunities for combining the best of SpaceWire, such as modularity, high speed, low latency, fault tolerance, and ease of implementation, with the vast experience of protocol design that has been implemented on Ethernet. We conside
Autor:
Paul Walker, Barry M. Cook
Publikováno v:
57th International Astronautical Congress.
Autor:
Barry M. Cook
Publikováno v:
The International Journal of Electrical Engineering & Education. 26:180-181