Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Barbara Pahl"'
Autor:
Anna Pak, Kambiz Nanbakhsh, Ole Hölck, Riina Ritasalo, Maria Sousa, Matthias Van Gompel, Barbara Pahl, Joshua Wilson, Christine Kallmayer, Vasiliki Giagka
Publikováno v:
Micromachines, Vol 13, Iss 4, p 544 (2022)
Liquid crystal polymer (LCP) has gained wide interest in the electronics industry largely due to its flexibility, stable insulation and dielectric properties and chip integration capabilities. Recently, LCP has also been investigated as a biocompatib
Externí odkaz:
https://doaj.org/article/a4e6e84ede9a4be0a19bcdc51a70167c
Autor:
Marta Kluba, Barbara Pahl, Vasiliki Giagka, Kambiz Nanbakhsh, Florian Bourgeois, Ronald Dekker, Wouter A. Serdijn
Publikováno v:
EMBC
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019
Platinum is widely used as the electrode material for implantable devices. Owing to its high biostability and corrosion resistivity, platinum could also be used as the main metallization for tracks in active implants. Towards this goal, in this work
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fc06619f2e2ac1339dd9a2f9d1fbbde2
https://doi.org/10.1109/embc.2019.8857702
https://doi.org/10.1109/embc.2019.8857702
Autor:
Christine Kallmayer, Andreas Ostmann, Barbara Pahl, K.-F. Becker, Lars Böttcher, K-D. Lang, J. Bauer, Tanja Braun, Martin Schneider-Ramelow, Julian Haberland, Rolf Aschenbrenner
Publikováno v:
International Symposium on Microelectronics. 2011:000142-000151
Decreasing the bill of materials for an electronic device saves development time, money and space. The integration of more and more functions not only on the chip (SoC; system on chip) but also in the package (SiP; system in package) is therefore a n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a4a5a525602c7a70b5fdac1bd413648
https://doi.org/10.4071/isom-2011-ta5-paper1
https://doi.org/10.4071/isom-2011-ta5-paper1
Publikováno v:
Microelectronic Engineering. 87:438-442
In this work we demonstrate a new approach for ultra fine flip chip interconnections based on carbon nanotubes as a wiring material. In contrast to other works we show patterned growth of multi walled CNTs on substrates with pre-structured bond pads
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::661fa94900576715d6dd99bef78e1a75
https://doi.org/10.1016/j.mee.2009.05.027
https://doi.org/10.1016/j.mee.2009.05.027
Publikováno v:
Microelectronics Reliability. 44:309-314
Due to the requirements of new light, mobile, small and multifunctional electronic products the density of electronic packages continues to increase. Especially in medical electronics like pace makers the minimisation of the whole product size is an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecbe37b001634eb7a927219cbb7368ba
https://doi.org/10.1016/j.microrel.2003.10.006
https://doi.org/10.1016/j.microrel.2003.10.006
Autor:
Klaus-Dieter Lang, Joao Marques, Thomas Suwald, Barbara Pahl, Arian Grams, Christine Kallmayer
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The embedding of ultrathin components in printed circuit boards has evolved into a production technology which is used worldwide. Many recent projects have shown the wide range of applications which include RF circuits and power electronics. The scop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::108b23e994a955a46384606d1cf382fa
https://doi.org/10.1109/ectc.2013.6575610
https://doi.org/10.1109/ectc.2013.6575610
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Flip chip assembly of silicon ICs on flexible substrates has gained more interest in the last years. On the one hand there are numerous low cost applications for this technology such as smart cards and smart labels, on the other hand flexible substra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc4d1be950271852dad75026c7ebf54d
https://doi.org/10.1109/ectc.2004.1320273
https://doi.org/10.1109/ectc.2004.1320273