Zobrazeno 1 - 10
of 397
pro vyhledávání: '"Barbara Miner."'
Autor:
Zitlow, Connie S.
Publikováno v:
The English Journal, 2001 Sep 01. 91(1), 114-117.
Externí odkaz:
https://www.jstor.org/stable/821674
Publikováno v:
Business Renaissance Quarterly. Winter2008, Vol. 3 Issue 4, p9-13. 5p.
Autor:
Sridhar Balakrishnan, Rohan Akolkar, Florian Gstrein, Feng Xia, Barbara Miner, M. Harmes, Arda Genc, Tejaswi K. Indukuri, Daniel J. Zierath, James S. Clarke
Publikováno v:
Microelectronic Engineering. 92:49-52
PVD CuMn self-forming barrier (SFB) approach was investigated on 300mm wafers as an alternative to conventional PVD Ta/Cu metallization. Cu fill on very aggressive dual damascene features targeted for beyond 32nm node was evaluated along with integra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::855d1d271cf2ec33016d9b1fe06eefbc
https://doi.org/10.1016/j.mee.2011.04.043
https://doi.org/10.1016/j.mee.2011.04.043
Autor:
José M. Sánchez, D. Gonzalez, Barbara Miner, J. Gil-Sevillano, Jose A. Maiz, Daniel Pantuso, Jun He, G. Xu, M.R. Elizalde, Jon M. Molina-Aldareguia, B. Sun, José M. Martínez-Esnaola, Tracey Scherban, I. Ocaña
Publikováno v:
Engineering Failure Analysis. 14:349-354
The thermo-mechanical robustness of interconnect structures is a key reliability concern for integrated circuits. The miniaturization process and the package/silicon interaction result in an increase of the thermal stresses whilst the use of new low-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2d801f85df648aa25fd129ffed4f19d
https://doi.org/10.1016/j.engfailanal.2006.02.008
https://doi.org/10.1016/j.engfailanal.2006.02.008
Autor:
Cristian V. Ciobanu, Kanwal Jit Singh, Hui J. Yoo, Gheorghe Stan, Barbara Miner, Christopher J. Jezewski, Sean W. King, Igor Levin, Alan Myers
Publikováno v:
Nano letters. 15(6)
Commonly known in macroscale mechanics, buckling phenomena are now also encountered in the nanoscale world as revealed in today’s cutting-edge fabrication of microelectronics. The description of nanoscale buckling requires precise dimensional and e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0cd7d632de2400b7e8309dcc53c34cf2
https://pubmed.ncbi.nlm.nih.gov/25950850
https://pubmed.ncbi.nlm.nih.gov/25950850
Autor:
I. Ocaña, Barbara Miner, M.R. Elizalde, Jon M. Molina-Aldareguia, José M. Sánchez, Tracey Scherban, D. Gonzalez, G. Xu, Jun He, Daniel Pantuso, Jose A. Maiz, J. Gil Sevillano, B. Sun, José M. Martínez-Esnaola
Publikováno v:
Acta Materialia. 54:3453-3462
A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures. A Berkovich indenter was used to initiate fracture in a silicon substrate and cracks propagated through the st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87ae631e8d43f1c094fab2238e503d5e
https://doi.org/10.1016/j.actamat.2006.03.027
https://doi.org/10.1016/j.actamat.2006.03.027
Publikováno v:
Microscopy and Microanalysis. 21:481-482
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad0bac827b1ca5c4439beef8b7cf1f98
https://doi.org/10.1017/s1431927615003207
https://doi.org/10.1017/s1431927615003207
Publikováno v:
Advances in X-ray Analysis. 39:707-712
Cobalt, titanium and titanium nitride film thickness standards were deposited. All metal film thicknesses were obtained from x-ray reflectivity (XRR) measurement using a conventional powder diffractometer. The cobalt film thicknesses were also thickn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::377a75cc4abb6687616d6be5c935af73
https://doi.org/10.1154/s0376030800023156
https://doi.org/10.1154/s0376030800023156
Autor:
Ebrahim Andideh, Harold W. Kennel, Barbara Miner, Florian Gstrein, Andre Budrevich, John J. Plombon
Publikováno v:
MRS Proceedings. 1079
The diffusion of aluminum (Al) from a source sandwiched between polycrystalline copper (Cu) thin films was investigated as a function of time and temperature through secondary ion mass spectroscopy (SIMS) and continuum simulations. Extracted diffusio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0e39eb8a8908697090516d6399fa249
https://doi.org/10.1557/proc-1079-n04-06
https://doi.org/10.1557/proc-1079-n04-06
Autor:
Barbara Miner, I. Ocaña, José M. Sánchez, M.R. Elizalde, Jon M. Molina-Aldareguia, J. Gil Sevillano, G. Xu, Jun He, Daniel Pantuso, D. Gonzalez, Jose A. Maiz, Tracey Scherban, B. Sun, José M. Martínez-Esnaola
Publikováno v:
AIP Conference Proceedings.
The thermo‐mechanical robustness of interconnect structures is a key reliability concern for integrated circuits. Cross‐sectional nanoindentation (CSN) was developed to characterize the interfacial adhesion in blanket films deposited on silicon s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d00c299891f3a58020ec9e79899525c
https://doi.org/10.1063/1.2173538
https://doi.org/10.1063/1.2173538