Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Barbara Bonnet"'
Autor:
Andrés Fontana, Anthony Delage, Aurélien Périgaud, Patrice Richard, David Carsenat, Guillaume Acikalin, Serge Verdeyme, Barbara Bonnet, Ludovic Carpentier, Nicolas Delhote
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. :1-14
Autor:
Serge Verdeyme, Schick Cindy, Nicolas Delhote, Anthony Delage, Barbara Bonnet, Ludovic Carpentier, Christophe Chaput, Thierry Chartier
Publikováno v:
IMS 2018
IMS 2018, Jun 2018, Philadelphia, United States
International Microwave Symposium (IMS 2018)
International Microwave Symposium (IMS 2018), Jun 2018, Philadelphia, United States
IMS 2018, Jun 2018, Philadelphia, United States
International Microwave Symposium (IMS 2018)
International Microwave Symposium (IMS 2018), Jun 2018, Philadelphia, United States
This work presents the conformal printing of milli-meter-wave transmission lines up to 67 GHz using inks based on silver nanoparticles. Several coplanar (CPW) lines have been printed over 3D Alumina test structures such as slope, half-sphere and ridg
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::21bb6aed781fc1ab9f026b37f9538139
https://hal-unilim.archives-ouvertes.fr/hal-02119000
https://hal-unilim.archives-ouvertes.fr/hal-02119000
Autor:
Marc Feron, Vladimir Cherman, Barbara Bonnet, Daniel Aguinaga, Mario Gonzalez, Ignas van Dommelen
Publikováno v:
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Sencio has been involved in an EU-funding H2020 project called PAMPA that was finalized last year. The goal of the project was to develop a plastic QFN-packaging solution for RF-components for Space application (Satellites). Today hermetic sealed cer
Autor:
Abbas El Mostrah, Cédric Quendo, Benjamin Potelon, Pascal Moroni, Laetitia Estagerie, Jean-François Favennec, Michel Le Coq, Eric Rius, Barbara Bonnet
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2015, 5 (5), pp.620-626
IEEE Transactions on Components, Packaging and Manufacturing Technology, Institute of Electrical and Electronics Engineers, 2015, 5 (5), pp.620-626
This paper introduces an effective way to build efficient miniature C-band filters using high-permittivity ceramics. The objective was to evaluate the feasibility of such filters using commercial electromagnetic simulators and a conventional fabricat
Autor:
J.-L. Muraro, Dominique Carisetti, Jean-Claude Clement, Nathalie Malbert, Hélène Fremont, Nathalie Labat, W. Ben Naceur, Barbara Bonnet
Publikováno v:
Microelectronics Reliability. 53:1375-1380
GaAs devices technology used for space applications have failed before the required 1000 h of the temperature humidity bias standard aging test. The results have shown that gate-source reverse bias is the most severe stress condition for transistors
Autor:
Philippe Monfraix, David Nevo, J.-L. Cazaux, Barbara Bonnet, Renaud Chiniard, Herve Legay, P. Couderc, O. Vendier
Publikováno v:
International Symposium on Microelectronics. 2012:000554-000560
Multi-Chip Module Vertical (MCM-V) technology, also called 3D packaging technology, enables the realization of a compact and low loss integrated feed for active antennas in Ka band. The active devices can be located in the vicinity of the radiating e
Autor:
J.-L. Muraro, Francis Pressecq, Kokou Adokanou, Karim Inal, Barbara Bonnet, Pierre Montmitonnet
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
International audience; Stress control is a main factor in the operation, performance and reliability of GaAs devices. A precise understanding of the impact of the mechanical stress on the performance and reliability of GaAs devices can lead to the i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::79f88cd57c4dd99a2f9f19fe2e9d74ce
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180774
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180774
Publikováno v:
Proceedings EuroSimE 2015
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p.-ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p.-ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
International audience; Accelerated life tests on microelectronic devices are needed to estimate their degradation under severe environment. THB (Temperature Humidity Bias) [1] at 85°C and 85%RH (relative humidity) is commonly used for reliability s
Autor:
Eric Rius, Cecile Debarge, Cédric Quendo, Jean-Claude Azzara, Jean-François Favennec, Jean-Louis Cazaux, Yann Clavet, Alexandre Manchec, Barbara Bonnet
Publikováno v:
Microwave Conference, 2009. APMC 2009. Asia Pacific
Microwave Conference, 2009. APMC 2009. Asia Pacific, Dec 2009, Singapore, Singapore. pp.2160-2163, ⟨10.1109/APMC.2009.5385510⟩
Microwave Conference, 2009. APMC 2009. Asia Pacific, Dec 2009, Singapore, Singapore. pp.2160-2163, ⟨10.1109/APMC.2009.5385510⟩
International audience; The miniaturization of embarked devices remains a major concern in many applications and in particular in the space domain. Alternative solutions based on the use of ceramic materials with very high dielectric permittivity, en
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c5e04b9f0de4ece3e34d412651dabfcc
https://hal.archives-ouvertes.fr/hal-00492011
https://hal.archives-ouvertes.fr/hal-00492011
Autor:
Herve Legay, P. Couderc, J. Chaplain, J.-L. Cazaux, Barbara Bonnet, Renaud Chiniard, Philippe Monfraix, C. Drevon
Publikováno v:
2008 38th European Microwave Conference.
Thanks to Vertical Multi-Chip Module packaging technology (MCM-V), a novel concept of integrated antenna feed in Ka band has been developed. This technology enables the integration of active elements very close to the radiating surface, which reduces