Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Baosen Hou"'
Autor:
Mingliang Wu, Baosen Hou, Shengcheng Shu, Ao Li, Qi Geng, He Li, Yumeng Shi, Minghui Yang, Shiyu Du, Jun-Qiang Wang, Shuzhi Liao, Nan Jiang, Dan Dai, Cheng-Te Lin
Publikováno v:
Nanomaterials, Vol 9, Iss 4, p 498 (2019)
Copper-based materials are common industrial products which have been broadly applied to the fields of powder metallurgy, electrical contact, and heat exchangers, etc. However, the ease of surface oxidation limits the durability and effectiveness of
Externí odkaz:
https://doaj.org/article/d9317ce579204bd9a90ed489ffbc9061
Autor:
Shuzhi Liao, Dan Dai, Yumeng Shi, Minghui Yang, Jun-Qiang Wang, He Li, Shiyu Du, Shengcheng Shu, Qi Geng, Cheng-Te Lin, Baosen Hou, Ao Li, Mingliang Wu, Nan Jiang
Publikováno v:
Nanomaterials, Vol 9, Iss 4, p 498 (2019)
Nanomaterials
Nanomaterials
Copper-based materials are common industrial products which have been broadly applied to the fields of powder metallurgy, electrical contact, and heat exchangers, etc. However, the ease of surface oxidation limits the durability and effectiveness of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e762bf06db4cba6e90df41fb4cb02232
https://www.mdpi.com/2079-4991/9/4/498
https://www.mdpi.com/2079-4991/9/4/498
Autor:
Xuesong Li, Baosen Hou, Dawei Zhang, Xuan Zhou, Xiaohong He, Kun Jia, Xiaobo Liu, Yan Hong, Junni Xie
Publikováno v:
Chemical Engineering Journal. 395:125123
Hierarchical anisotropic superparticles derived from the controlled assembly of individual plasmonic nanoparticles have been recognized as promising building blocks for surface-enhanced Raman spectroscopy (SERS) nanosensors. Thus, the protocols that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21044954941575ad8a3afa778257fc14
https://doi.org/10.1016/j.cej.2020.125123
https://doi.org/10.1016/j.cej.2020.125123
Autor:
Zhang Qiang, Zhixiang Zhu, Qiang Wang, Shengcheng Shu, Mingliang Wu, Li Shuangyi, Yi Ding, Ao Li, Bao-An Chen, Nan Jiang, Dan Dai, Yu Han, Baosen Hou, Cheng-Te Lin
Publikováno v:
Materials
Materials, Vol 11, Iss 8, p 1459 (2018)
Materials, Vol 11, Iss 8, p 1459 (2018)
Copper powder has broad applications in the powder metallurgy, heat exchanger, and electronic industries due to its intrinsically high electrical and thermal conductivities. However, the ease of formation of surface oxide or patina layer raises diffi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c2a39eb18ec6e08460b7d81652d40c3e
http://europepmc.org/articles/PMC6119898
http://europepmc.org/articles/PMC6119898