Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Baojun Qiu"'
Autor:
Renbin Huang, Daohua Zhan, Xiuding Yang, Bei Zhou, Linjun Tang, Nian Cai, Han Wang, Baojun Qiu
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1375 (2023)
In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in the detection of chip defects, which represents an important part of the quality inspection of products after
Externí odkaz:
https://doaj.org/article/d9470ae273bf4b61a24f4d1ef73e23be
Autor:
Daohua Zhan, Jian Lin, Xiuding Yang, Renbin Huang, Kunran Yi, Maoling Liu, Hehui Zheng, Jingang Xiong, Nian Cai, Han Wang, Baojun Qiu
Publikováno v:
Micromachines, Vol 14, Iss 6, p 1119 (2023)
Integrated circuit (IC) X-ray wire bonding image inspections are crucial for ensuring the quality of packaged products. However, detecting defects in IC chips can be challenging due to the slow defect detection speed and the high energy consumption o
Externí odkaz:
https://doaj.org/article/d4e3da056f274ce6bd9ef9f699a893d4
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 72:1-12
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2d8efcd2d5751f23811940ba3202860
https://doi.org/10.1109/tim.2023.3235435
https://doi.org/10.1109/tim.2023.3235435
Publikováno v:
IEEE Transactions on Plasma Science. 50:4812-4819
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc172016484f3db27aac2fcec389f707
https://doi.org/10.1109/tps.2022.3218905
https://doi.org/10.1109/tps.2022.3218905
Autor:
Wang, Shuai Zhou, Kaixue Ma, Yugong Wu, Peng Liu, Xianghong Hu, Guojian Nie, Yan Ren, Baojun Qiu, Nian Cai, Shaoqiu Xu, Han
Publikováno v:
Electronics; Volume 12; Issue 12; Pages: 2709
As the core carrier of information storage, a semiconductor memory device is a basic product with a large volume that is widespread in the integrated circuit industry. With the rapid development of semiconductor manufacturing processes and materials,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=multidiscipl::2a6d3b3026b7baecff737edeb71b824b
Autor:
Shuai Zhou, Zhenpei Lin, Baojun Qiu, Han Wang, Jingang Xiong, Chang He, Bei Zhou, Yiliang Pan, Renbin Huang, Yiliang Bao, Nian Cai
Publikováno v:
Electronics; Volume 11; Issue 16; Pages: 2556
In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::28ba69c5fb6462cc87826fb1954424d2
Autor:
Baojun Qiu, Jingang Xiong, Han Wang, Shuai Zhou, Xiuding Yang, Zhengpei Lin, Maolin Liu, Nian Cai
Publikováno v:
Electronics. 11:542
With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4dfbe333416d08873f79af799bc27c46
https://doi.org/10.3390/electronics11040542
https://doi.org/10.3390/electronics11040542
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
In order to facilitate the entire board reflow process, the pin of a DIP(Dual In-line Package) component is bent into a gull-wing type pin. However, after a short period of service, the failure of the Dual Inline Package surface-mounted solder joints
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39d6efd72569b9301b1c89c43f04f0e0
https://doi.org/10.1109/icept.2018.8480664
https://doi.org/10.1109/icept.2018.8480664
Autor:
Haizheng Zhang1 haizhengzhang@gmail.com, Baojun Qiu2, Ivanova, Kristinka3, Giles, C. Lee3, Foley, Henry C.3, Yen, John3
Publikováno v:
Journal of the American Society for Information Science & Technology. May2010, Vol. 61 Issue 5, p964-977. 14p. 5 Charts, 8 Graphs.
Publikováno v:
Petroleum Science and Technology. 24:1331-1338
Without any organic solvent or activator, the selective oxidation of cyclohexane with air to afford cyclohexanol and cyclohexanone was investigated over Co/Al2O3 and Co-M/Al2O3 (M = Cu, Zn, and Ni) catalysts prepared by sol-gel method. The activity o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c54ad04d6343c2cfbebcaf6d2229dd0e
https://doi.org/10.1081/lft-200056674
https://doi.org/10.1081/lft-200056674