Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Banothu Rakesh"'
Autor:
Dumpa Prasad, M. Suresh, Asisa Kumar Panigrahy, Ch. Usha Kumari, Banothu Rakesh, N. Arun Vighnesh
Publikováno v:
Materials Today: Proceedings. 45:1399-1402
A practical exhibition of the consequences of the 3D IC in heat management by adding the fin and heat spreaders to thermal through silicon via (TTSV) and IC respectively is proposed in this paper. Thermal cooling and its distribution of burnt potenti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd3002271c716e486a2c215224a61442
https://doi.org/10.1016/j.matpr.2020.07.092
https://doi.org/10.1016/j.matpr.2020.07.092
Autor:
Banothu Rakesh, Venkata Kiran Sanipini, N. Santoshi, A. Arunkumar Gudivada, Asisa Kumar Panigrahy, Aruna Jyothi Chamanthula
Publikováno v:
Materials Today: Proceedings. 45:1742-1746
Three Dimensional IC (3D IC) integration is one of the emerging technology which suits CMOS applications by stacking various IC layers vertically. In 3D IC, IC Layers are interconnected electrically using Through Silicon Vias (TSV’s) and mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ceaaeed8e86efff34a4512ffef85c01
https://doi.org/10.1016/j.matpr.2020.08.621
https://doi.org/10.1016/j.matpr.2020.08.621
Autor:
Kailaas Mahindra, Banothu Rakesh, Marri Sai Venkat Goud, N. Arun Vignesh, Asisa Kumar Panigrahy, T. Padma
Publikováno v:
Materials Today: Proceedings. 33:3085-3088
Thermal through silicon via (TTSV) and heat spreaders plays a vital role in heat management in 3-Dimentional IC integration. However in recent years FIN to TTSV and heat spreaders has proposed to detects and spread heat in any one direction which lea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ccf1d558bacdf38093f6e76140e9e4d
https://doi.org/10.1016/j.matpr.2020.03.663
https://doi.org/10.1016/j.matpr.2020.03.663
Autor:
Banothu Rakesh, N. Arun Vignesh, Dadaipally Pragathi, Asisa Kumar Panigrahy, T. Padma, P. Sriram Kumar
Publikováno v:
Materials Today: Proceedings. 33:3117-3123
Semiconductor Industries are mainly facing problems by using planar integration (2D IC) in order to overcome the paradigm shift has been adopted as vertical IC integration so called 3D IC. It not only provides higher bandwidth, higher system performa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6c9ea5e5fa93d40bfd61e902d2dbce1
https://doi.org/10.1016/j.matpr.2020.03.737
https://doi.org/10.1016/j.matpr.2020.03.737