Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Bang-Hao Wu"'
Publikováno v:
Journal of Fuel Chemistry and Technology. 50:1202-1210
Publikováno v:
Journal of Applied Electrochemistry. Mar2005, Vol. 35 Issue 3, p305-310. 6p.
Autor:
Bang Hao Wu, Yung Hsiang Hsu, Wei Yi Lu, Yi Chin Chou, Tsung Tai Wu, Chi Yen Hung, Chia Rong Sheu
Publikováno v:
Molecular Crystals and Liquid Crystals. 613:143-148
A liquid crystal lens array (LCLA) with switchable dual apertures via a middle layer of hole-array patterned metal foil in the cell is demonstrated. The behaviour of electro-optical capabilities in fabricated LC lens arrays is directly relative to th
Autor:
Bang-hao Wu, 吳邦豪
103
Bridge is the one of the most important structures in daily life. Bridge safety is affected by many factors such as environmental conditions, deteriorated situation, and external forces (e.g., floods). Bridge safety has drawn much attention
Bridge is the one of the most important structures in daily life. Bridge safety is affected by many factors such as environmental conditions, deteriorated situation, and external forces (e.g., floods). Bridge safety has drawn much attention
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/17453964522727602830
Publikováno v:
Journal of Applied Electrochemistry. 33:823-830
The adsorption behaviour of polyethylene glycol (PEG) in the presence of chloride ion in an acid copper electrolyte was investigated by several electrochemical methods including chronopotentiometry, linear sweep voltammetry, cyclic voltammetry and el
Autor:
Ching-Wen Hsiao, Franklin Chau-Nan Hong, Ho Tsan-Yu, Chiang Hsin-Chun, Bang-Hao Wu, Chun-Chin Chen, Chia Rong Sheu, Jian-Lung Chen
Publikováno v:
The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004..
A commercially available polyimide and two forms of diamond-like carbon films being ion beam exposure were used to figure out their effects on the electrical characteristics of the liquid crystal cell.
Autor:
Bang-Hao Wu, 吳邦豪
91
Void-free electroplating for IC copper interconnects was examined theoretically and experimentally. In Chapter 2, a theoretical model based on electrochemistry and thermodynamic calculation for species’ microscopic concentrations was develo
Void-free electroplating for IC copper interconnects was examined theoretically and experimentally. In Chapter 2, a theoretical model based on electrochemistry and thermodynamic calculation for species’ microscopic concentrations was develo
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/79055208999861529426
Autor:
Bang-hao Wu, 吳邦豪
88
Because the trenches or vias of IC interconnect are very tiny and have large aspect ratio, how to deposit copper without void formation is very important. Development of numerical method from FDM、FEM to BEM or even Free-Element Method enabl
Because the trenches or vias of IC interconnect are very tiny and have large aspect ratio, how to deposit copper without void formation is very important. Development of numerical method from FDM、FEM to BEM or even Free-Element Method enabl
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/13959864307753170832
Publikováno v:
Journal of The Electrochemical Society. 150:C7
A multi-ion deposition model, based on constant applied voltage, was used to calculate the current distribution for anisotropic deposition in electrolyte composed of CuSO 4 and H 2 SO 4 . The bulk species concentration was calculated by Pitzer's mode
Autor:
Bang-Hao Wu, Tsan-Yu Ho, Hsin-Chun Chiang, Ching-Wen Hsiao, Chun-Chin Chen, Hong, F.C.-N., Chia-Rong Sheu, Jian-Lung Chen
Publikováno v:
17th Annual Meeting of the IEEELasers & Electro-Optics Society, 2004 (LEOS 2004); 2004, p37-37, 1p