Zobrazeno 1 - 10
of 7 588
pro vyhledávání: '"Ball grid array"'
Autor:
Reddy, Vishnu V. B.1, Williamson, Jaimal2, Sitaraman, Suresh K.3 suresh.sitaraman@me.gatech.edu
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2021, Vol. 18 Issue 4, p183-189. 7p.
Autor:
Yeh, Chi-Hao, Tsai, Du-Ming
Publikováno v:
International Journal of Production Research. 12/20/2001, Vol. 39 Issue 18, p4281-4299. 19p. 9 Diagrams, 1 Chart, 3 Graphs.
Autor:
Liu, Xiubo1 eesulay@tju.edu.cn, Zhang, Wei1 tjuzhangwei@tju.edu.cn, Hao, Dongning1 dnhao@tju.edu.cn, Liu, Yanyan2 lyytianjin@nankai.edu.cn
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology. Sep2022, Vol. 12 Issue 9, p1567-1574. 8p.
Autor:
Iakovidis, George1 giakovidis@bnl.gov
Publikováno v:
EPJ Web of Conferences. 2018, Vol. 174, p1-4. 4p.
Autor:
Bruno, Lars1 lars.bruno@ericsson.com, Gustafson, Benny1 benny.gustafson@ericsson.com
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Apr2019, Vol. 16 Issue 2, p91-102. 12p.
Publikováno v:
Journal of Materials Research and Technology, Vol 28, Iss , Pp 3573-3582 (2024)
Ball Grid Array (BGA) packaging method has been widely used in microelectronic devices, and electromigration (EM) in BGA is a crucial reliability issue, determining the performance of the products. Herein, we report a new failure mode induced by a co
Externí odkaz:
https://doaj.org/article/db642bd86e2a4ad49d06aeea2485cb68
Autor:
HUBBLE, NEIL1 nhubble@akrometrix.com, RABUN, CHANCE2
Publikováno v:
Printed Circuit Design & Fab: Circuits Assembly. Aug2023, Vol. 40 Issue 8, p101-122. 22p.
Publikováno v:
Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ). May2017, Vol. 42 Issue 5, p2075-2086. 12p. 2 Color Photographs, 3 Black and White Photographs, 3 Diagrams, 1 Chart, 7 Graphs.
Autor:
Vogel, Gert1 gert.vogel@siemens.com
Publikováno v:
Electronic Device Failure Analysis. May2017, Vol. 19 Issue 2, p4-9. 5p.