Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Balint Medgyes"'
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8bc2fe0cc36510cede484cfb1a47e63
https://doi.org/10.1109/estc55720.2022.9939556
https://doi.org/10.1109/estc55720.2022.9939556
Autor:
Ali Gharaibeh, Balint Medgyes
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ab31ae5b8f0ee1205bcc27941654aa4
https://doi.org/10.1109/estc55720.2022.9939484
https://doi.org/10.1109/estc55720.2022.9939484
Autor:
Attila Geczy, Andras Csiszar, Egon Rozs, Istvan Hajdu, Balint Medgyes, Oliver Krammer, Daniel Straubinger, Laszlo Gal
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12c83c8bf9afd939de2b23fdaefdc8d1
https://doi.org/10.1109/isse54558.2022.9812827
https://doi.org/10.1109/isse54558.2022.9812827
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e46dc8b23e4e23aea303e85be98f92a
https://doi.org/10.1109/isse54558.2022.9812805
https://doi.org/10.1109/isse54558.2022.9812805
Publikováno v:
International Journal of Minerals, Metallurgy and Materials. 28:98-110
We investigated erosion-corrosion (E-C) and its mitigation on the internal surface of the expansion segment of N80 steel tube in a loop system using array electrode technique, weight-loss measurement, computational-fluid-dynamics simulation, and surf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::590840c3c61518523c1b419883aec592
https://doi.org/10.1007/s12613-020-2086-0
https://doi.org/10.1007/s12613-020-2086-0
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:15308-15321
Sn–Ag–Cu solder alloys were usually modified using trace elements to achieve various properties. This paper investigated the effect of additives of Ni, Bi, and Sb on the microstructure and corrosion behavior of SAC alloys under application condit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4edf4e76e14c56164a49f44a0dbb8d3a
https://doi.org/10.1007/s10854-020-04095-y
https://doi.org/10.1007/s10854-020-04095-y
Autor:
Ali Gharaibeh, Balint Medgyes
Publikováno v:
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::111dc24dd0080518b254552d497b791d
https://doi.org/10.1109/siitme53254.2021.9663682
https://doi.org/10.1109/siitme53254.2021.9663682
Publikováno v:
Materials
Materials, Vol 14, Iss 5237, p 5237 (2021)
Volume 14
Issue 18
Materials, Vol 14, Iss 5237, p 5237 (2021)
Volume 14
Issue 18
Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore its appl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6b2082d7ced7bfdcc29c155b386125c2
http://europepmc.org/articles/PMC8465352
http://europepmc.org/articles/PMC8465352
Autor:
Balint Medgyes, Zhi Zhang, Junying Hu, Xiankang Zhong, Bokai Liao, Yan Zheng, Dezhi Zeng, Wenjun Lu
Publikováno v:
Corrosion Science. 156:10-15
Ag participating the electrochemical migration (ECM) of Sn-Ag based alloys is still controversial. In this work, Ag+ concentration in electrolyte layer and Ag distribution in dendrites formed during the ECM of 96.5Sn-3Ag-0.5Cu alloy were investigated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7517aea635d384313810b860b7f28b09
https://doi.org/10.1016/j.corsci.2019.05.004
https://doi.org/10.1016/j.corsci.2019.05.004
Publikováno v:
Soldering & Surface Mount Technology. 31:146-156
Purpose This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the technology, i.e. soft and vacuum VPS; measurement and characteri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c61f4dbf6c3b0b6ba2c9fc39b99dbe2d
https://doi.org/10.1108/ssmt-10-2018-0042
https://doi.org/10.1108/ssmt-10-2018-0042