Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Balasubramanian, Senthil Kumar"'
Autor:
Khader, Syed Zameer Ahmed, Syed Zameer Ahmed, Sidhra, Balasubramanian, Senthil Kumar, Arunachalam, Thanga kumar, Kannappan, Geetha, Mahboob, Mohamed Rafi, Ponnusamy, Ponmurugan, Ramesh, Kishore
Publikováno v:
In Integrative Medicine Research June 2017 6(2):131-140
Autor:
Sarangapani Murali, Lim Yee Weon Evonne, Lo Miew Wan, Bayaras Abito Danila, Loke Chee Keong, Lo Yee Ting, Balasubramanian Senthil Kumar, Kang Sungsig SS
Publikováno v:
IMAPSource Proceedings. 2022
Sn57Bi1Ag alloy system meets the basic solderability requirements while reliability of solder is less known. The presence of intermetallics that form at the solder-joint interface and in the bulk solder is the primary reason to cause joint failure on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a6f56e8c9e1195a517ad4cf05c47ea5
https://doi.org/10.4071/001c.74735
https://doi.org/10.4071/001c.74735
Autor:
Sarangapani Murali, Lim Yee Weon Evonne, Dhayalan Mariyappan, Lo Miew Wan, Chong Mei Hoe Joanne, Balasubramanian Senthil Kumar, Kang Sungsig SS
Publikováno v:
IMAPSource Proceedings. 2022
Formation of free air ball (FAB) within the range of certain processing parameters leads to excellent bondability (distributed intermetallic coverage (IMC) at the center and periphery of the bonded ball interface, bonded ball concentricity, etc.) on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a7dfed84b95ac45abd052c13666059a
https://doi.org/10.4071/001c.74776
https://doi.org/10.4071/001c.74776
Autor:
Annamalai Natarajan, Radhakrishnan Prabakarakrishnan, Kasivelu Govindaraju, Vimal Sugumar, Kuppusamy Sathiskumar, Jayaraman Narenkumar, Aadhikesavan Ramanan, Balasubramanian Senthil Kumar
Publikováno v:
Aquaculture International.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::769b81737bd0737b0c4d316dc12394ee
https://doi.org/10.1007/s10499-023-01064-0
https://doi.org/10.1007/s10499-023-01064-0
Autor:
Audrey Long Wee Seng, Liu Yu, Pang Hui Shyan, Sarangapani Murali, Balasubramanian Senthil Kumar, Kang SS Sungsig
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e355c946201b743aa2539a7ac529605
https://doi.org/10.1109/eptc56328.2022.10013301
https://doi.org/10.1109/eptc56328.2022.10013301
Autor:
Zhang Rui Fen, Lim Chze Min Jason, Yam Lip Huei, Balasubramanian Senthil Kumar, Sarangapani Murali, Zhang Han Wen, SS Kang Sungsig, Chan Li-San
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcbfe379c48b310dfa90316199719333
https://doi.org/10.1109/eptc56328.2022.10013151
https://doi.org/10.1109/eptc56328.2022.10013151
Autor:
Sylvia Sutino, Sebastian Fritzsche, Li-San Chan, Santosh Kumar Rath, Chieng Yu Yuan, Balasubramanian Senthil Kumar, Joel Agala, HanWen Zhang, Yam Lip Huei, Lo Yee Ting, Stefan Mausner, Sungsig Kang
Publikováno v:
International Symposium on Microelectronics. 2020:000025-000033
This paper reports the comparison of two solder pastes made using a no clean flux platform and ultrafine SAC305 powders of Type 7 and Type8+, made using Heraeus’ Welco® technology. The application tests were carried out using 008004 components, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d371e19c5773fce84b22710f8e79de90
https://doi.org/10.4071/2380-4505-2020.1.000025
https://doi.org/10.4071/2380-4505-2020.1.000025
Autor:
Tan Swee Seng Eric, Sarangapani Murali, Lim Yee Weon Evonne, Kim Tae Yeop James, Balasubramanian Senthil Kumar, Kang Il Tae, Zhang Xi, Tok Chee Wei
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
For the last few years there is a demand in wire bonding industry for an alternate wire to gold as well to bond similar to gold without purging inert or reactive gas during free air ball (FAB) formation. Currently, alloyed/coated copper and alloyed s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e6999e4a78e74e128c6c37aea98e643
https://doi.org/10.1109/eptc.2017.8277574
https://doi.org/10.1109/eptc.2017.8277574
Autor:
KhaderSyed Zameer, Ahmed, Syed Zameer Ahmed, Sidhra, Ponnusamy, Ponmurugan, Balasubramanian Senthil, Kumar
Publikováno v:
Pakistan journal of pharmaceutical sciences. 29(5)
Solanum trilobatum Linn is a medicinal plants used in India from many centuries to cure various diseases. The purpose of the study is to evaluate the ameliorative potential of the ethanolic leaf extract and fractions of Solanum trilobatum (St) agains
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::ab709a9ff0153a4cb89145cdf0b6be3c
https://pubmed.ncbi.nlm.nih.gov/27731814
https://pubmed.ncbi.nlm.nih.gov/27731814
Publikováno v:
Indian Journal of Nuclear Medicine : IJNM : The Official Journal of the Society of Nuclear Medicine, India
Objective: The aim of the study was to evaluate the salivary gland dysfunction in a patient with uncontrolled type 2 diabetes using salivary gland scintigraphy. Materials and Methods: patients included in the study were 32 uncontrolled type 2 diabeti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0410ca22beb50ecbaaed0a7b8e7b1e1a
http://europepmc.org/articles/PMC3628255
http://europepmc.org/articles/PMC3628255