Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Balaram Ghosal"'
Autor:
Asim Kumar Panda, Balaram Ghosal
Publikováno v:
International Journal of Computer Applications. 95:1-4
The world as on date revolutionized by the use of internet, the number of devices accessing the internet is growing by second. Most of the devices use wireless communication for this; now this has unfortunately led to an increase in network complexit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ed1dacb2d9dc4b245218b85e8f7f285
https://doi.org/10.5120/16635-6507
https://doi.org/10.5120/16635-6507
Autor:
P. Palmateer, D. Waldman, J. Kim, J. Corso, Balaram Ghosal, R. Pasco, G. Advocate, S. Cvikevich, Y. Fu, A. Arnold, Peter J. Brofman, S. Kapur, P. Hayunga, D.-Y. Shih
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:369-377
Three low-stress pin attachment structures were developed for the glass ceramic-copper multilayer ceramic (MLC) packaging technology used in IBM ES 9000 processors. The structures include the multilayer thin-film I/O pads, taper-headed pin and low-st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6982a855ed49c31118604889c2fe1ea
https://doi.org/10.1109/33.148505
https://doi.org/10.1109/33.148505
Autor:
Peter J. Brofman, D.-Y. Shih, Y. Fu, Balaram Ghosal, Maurice Heathcote Norcott, Paul A. Lauro, P. Palmateer, S. Kapur
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
The performance of the IBM glass ceramic-copper multilayer ceramic module (MLC) is significantly enhanced by a revolutionary set of packaging materials. Low dielectric constant cordierite glass ceramic (/spl epsiv/-5.0), co-sintered with high conduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac22cf63db2bea3e6ad6e7e14237c9d4
https://doi.org/10.1109/ectc.1995.517768
https://doi.org/10.1109/ectc.1995.517768
Publikováno v:
Area Array Interconnection Handbook ISBN: 9781461355298
The technology surrounding integrated circuits has improved drastically since first introduced in 1959. The desire to miniaturize circuits, coupled with increased speed and decreased energy consumption requirements has led to present day highly integ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32912070b3b027af691bc4ba89883bbd
https://doi.org/10.1007/978-1-4615-1389-6_14
https://doi.org/10.1007/978-1-4615-1389-6_14
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