Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Balanon, A"'
Publikováno v:
Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were perf
Externí odkaz:
http://arxiv.org/abs/0801.1003
Publikováno v:
Packaging Technology and Science. 36:379-388
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d63dbaf35aa26908b50815e77a734f53
https://doi.org/10.1002/pts.2714
https://doi.org/10.1002/pts.2714
Autor:
Balanon, Lourdes G., author
Publikováno v:
Children on the Move: How to Implement Their Right to Family Life. :123-131
Autor:
Hajah Sueno, Christian Lloyd Amar, John Ronelo Menasalvas, Aaron Jake Candido, Cuburt Balanon
Publikováno v:
EPH - International Journal of Science And Engineering. 8:1-8
To prevent the coronavirus from spreading, the government adopted measures such as wearing a face mask in public locations. The researchers aimed to create a face detection system using the MobilenetV2 architecture that would identify a person’s fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b6d05c9e9f2a4c5fc084c9ffee79b77
https://doi.org/10.53555/ephse.v8i8.1902
https://doi.org/10.53555/ephse.v8i8.1902
Akademický článek
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Publikováno v:
Geological Society of America Abstracts with Programs.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3905ae4fe1f6a5180ec120df18a511e
https://doi.org/10.1130/abs/2021am-368250
https://doi.org/10.1130/abs/2021am-368250